Abstract: A system for multi-verifiable, as-built construction modeling in which accurate, independently verifiable site maps, floorplan, exterior and interior elevations alongside detailed checklists for subcontractors, suppliers, and professional services can be generated for providing detailed written proposals, cost estimates and critical path timeline.

Abstract: To form a metal layer on a semiconductor wafer, a first portion of a first tungsten/titanium layer is formed by sputtering tungsten/titanium onto the semiconductor wafer in a first evacuated sputter station. A second portion of the first tungsten/titanium layer is then sputtered on in a second evacuated sputter station. Then the tungsten/titanium layer is exposed to air before forming an aluminum layer on top of the tungsten/titanium layer. Finally, a second tungsten/titanium layer is deposited on the aluminum layer. By forming the first tungsten/titanium layer in two steps two sequential sputter stations, the amount of tungsten/titanium deposited onto each sputter station's hardware and shielding is reduced during the processing of each semiconductor wafer, thereby increasing the number of wafers which can be processed by the sputter stations before the tungsten/titanium deposited on the sputter stations' hardware and shielding needs to be removed.