Abstract: A photonic integrated circuit (PIC)-based imager blade includes a number of PIC imager units stacked on top of one another. Each PIC imager unit includes a PIC coupled, at a first end and a second end, to a first set of lenslets and a second set of lenslets, respectively. An electronic integrated circuit (EIC) is coupled to the PIC. Pairs of lenslets of the first and second set of lenslets are optically coupled to respective waveguides embedded in the PIC. The PIC imager units have different lengths, and longer PIC imager units include larger lenslets.

Abstract: An optical aperture system is provided that includes a photonic integrated circuit. The photonic integrated circuit includes a plurality of apertures, a plurality of optical phase shifters coupled to respective apertures of the plurality of apertures, an optical splitter-combiner coupled to the plurality of optical phase shifters, an optical switch coupled to the optical splitter-combiner, a light source coupled to the optical switch, and a photodetector coupled to the optical switch. The optical aperture system further includes a controller configured to execute a first set of instructions to control the plurality of optical phase shifters and the light source in accordance with a first operating mode of a plurality of operating modes of the optical aperture system, and a processor configured to execute a second set of instructions to process an output of the photodetector in accordance with the first operating mode of the optical aperture system.

Abstract: A scalable interferometric imaging and laser communications system integrated as a single satellite payload is provided. Multiple lenslets are coupled via associated waveguides to a single multi-mode interferometer in an N-arm beam combination using a PIC based architecture. The multi-mode interferometer is coupled to a communication sensor via a splitter and to an imaging sensor via an array waveguide grating, which in turn are coupled to a processor. The system interferes all input waveguides simultaneously and provides OPD control over individual input waveguides.

Abstract: A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of the first lenslet array and respective lenslets of the second lenslet array are coupled to respective waveguides embedded in the in the PIC.

Abstract: A photonic integrated circuit (PIC) imager includes a substrate, and a number of PIC imager units disposed in an arbitrary configuration on the substrate. Each PIC imager unit includes a PIC coupled to an optical connector, and a number of lenslets configured as a linear lenslet array and optically coupled to an edge of the PIC. Pairs of lenslets of the linear lenslet array are optically coupled to respective waveguides embedded in the PIC.

Abstract: A scalable front end system for a high speed free space optical (FSO) communication system includes multiple optical array assemblies. Each optical array assembly includes an optical array, an angle sensor, a steering system and a base. The multiple optical array assemblies are coupled to respective electro-optic modulators, which in turn are coupled to a splitter, all disposed within an enclosure with one input/output connection.

Abstract: A fiber-coupled phased-array includes a first photonic integrated circuit (PIC) and a second PIC. The first PIC includes a first set of lenslets and waveguides. The second PIC includes a second set of lenslets and waveguides and is placed at a distance from the first PIC. The optical fibers couple the first PIC to the second PIC and form an interferometric imager that can sample spatial frequencies of a target. Optical delay errors induced by a relative placement of the first PIC and the second PIC are compensated for.

Abstract: A modular assembly for an imaging system can allow precision alignment to occur in isolated manufacturing stages, with the separate components being assembled together in later stages. An exemplary system includes a support structure, multiple imaging modules exchangeably coupled to the support structure and each including lenslets and a photonic integrated circuit (PIC) device arranged to receive light from the lenslets, multiple fiber arrays each connected to corresponding one of the multiple imaging modules, and a camera system connected to the fiber arrays. The lenslets the PIC device can be integrally coupled prior to assembly with the support structure, so that precise alignment of the lenslets with respect to the PIC device is performed in isolation.

Abstract: A multi-aperture optical system includes a photonic integrated circuit, a spacer substrate coupled to the photonic integrated circuit, a plurality of optical cells, a beam combiner, and a photodetector coupled to the beam combiner. The photonic integrated circuit, the spacer substrate, the plurality of optical cells, the beam combiner, and the photodetector are integrated as a single monolithically formed optical head. Each optical cell includes a focusing optical element formed on the spacer substrate and configured to focus the light through the substrate and onto a folding element. The folding element is integrated into the photonic integrated circuit to couple light incident on the optical cell into a waveguide. The waveguide is coupled to the phase shifter to transport the light reflected by the folding element through a phase shifter. The phase shifter is coupled to the focusing optical element to shift a phase of an optical signal received by the focusing optical element.

Abstract: A multi-aperture optical system includes a photonic integrated circuit, a spacer substrate coupled to the photonic integrated circuit, a plurality of optical cells, a beam combiner, and a photodetector coupled to the beam combiner. The photonic integrated circuit, the spacer substrate, the plurality of optical cells, the beam combiner, and the photodetector are integrated as a single monolithically formed optical head. Each optical cell includes a focusing optical element formed on the spacer substrate and configured to focus the light through the substrate and onto a folding element. The folding element is integrated into the photonic integrated circuit to couple light incident on the optical cell into a waveguide. The waveguide is coupled to the phase shifter to transport the light reflected by the folding element through a phase shifter. The phase shifter is coupled to the focusing optical element to shift a phase of an optical signal received by the focusing optical element.

Abstract: A method of manufacturing a monolithic array of lenslets that inject light into waveguides without the need for alignment of a separate lenslet array and waveguide array is provided. The waveguide array may be incorporated as a monolithic or fused piece with the substrate on which the lenslet array is to be written. A method of producing a flat, thin monolithic collimator array having a form corresponding to that of a PIC, with the input/output lenslet array located on the top surface of the collimator array is provided. A method for bonding a two-dimensional (2-D) array of lenslets on top of a photonic integrated circuit (PIC) substrate with a small gap for thermal expansion between lenslet blocks is provided.