Abstract: The disclosure is directed to a polyethylene or similar flexible package having a maze vent to allow the escape of air from the interior of the package filled with powdered or granular material. The maze vent comprises an interior vented seal gap, a maze vent channel, and a channel vent. The maze vent allows air to escape during the filling process while maintaining the powdered or granular material within the bag and preventing ingress of air, moisture and other contaminants. The disclosure is directed to a such a package by itself or as a liner to a multiple paper ply satchel bottom bag, the poly liner being free within the innermost ply except for attachment at the mouth of the bag. Further, the satchel bottom bag of the present disclosure may contain a reinforcing patch on the satchel bottom. Additionally, the reinforcing patch may have an opener for easy opening of the bag.

Abstract: The present invention relates to a method and a system for operating a semiconductor factory. The factory comprises equipment (8) for processing semiconductor wafers, and an automated material handling system (12). The invention comprises clamping a wafer carrier (16) while a wafer is processed by a particular tool (10), continuing clamping the wafer carrier (16) after processing, and unclamping the wafer carrier (16) when the automated material handling system (12) is ready for removing the wafer carrier (16) from the tool (10).