Abstract: A multi-facetted antenna array is disclosed for omnidirectional signalling. The multi-facetted antenna array includes a plurality of abutting facets having a planar region under the patch antenna structures, and curving regions between the planar regions and across the abutting edges of the facets. The planar regions under the patch antenna provide proper RF antenna performance, while the curved regions minimize the size of the assembled array. Further disclosed is a method of mounting the associated RF interface module across an inside corner formed by abutting facets. The disclosed multi-facetted antenna array is particularly useful for overcoming the unsightly size and wind loading problems of multi-facetted antenna arrays known in the art.

Abstract: A technique for accommodating electronic components on a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for accommodating electronic components on a multilayer signal routing device. Such a method comprises determining a component space that is required to accommodate a plurality of electronic components on a surface of a multilayer signal routing device, and then forming at least one signal routing channel on at least the surface of the multilayer signal routing device, wherein the at least one signal routing channel has a channel space that is equal to or greater than the component space.

Abstract: A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the number of layers in a multilayer signal routing device having a plurality of electrically conductive signal path layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer signal routing device. In such a case, the method comprises routing electrical signals on the plurality of electrically conductive signal path layers in the multilayer signal routing device for connection to and from a high density electrically conductive contact array package based at least in part upon at least one of an electrically conductive contact signal type characteristic and an electrically conductive contact signal direction characteristic.

Abstract: A technique for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as an interconnect array for electrically interconnecting electrical signals between an electronic component and a multilayer signal routing device having a plurality of electrically conductive signal path layers. In such a case, the interconnect array comprises a plurality of electrically conductive contacts grouped into a plurality of arrangements of electrically conductive contacts, wherein each of the plurality of arrangements of electrically conductive contacts are separated from other adjacent ones of the plurality of arrangements of electrically conductive contacts by a channel that is correspondingly formed in the multilayer signal routing device such that an increased number of electrical signals may be routed therein on the plurality of electrically conductive signal path layers.

Abstract: A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least one component. Each heat sink is at least partially thermally isolated from other heat sinks to mitigate heat flow from high-power components to heat sensitive components. Further, all of the heat sinks associated with the circuit package are electrically coupled to provide electromagnetic shielding. A thermally insulative and electrically conductive gasket is employed to couple adjacent heat sinks.