Abstract: A method for producing a number of chip cards includes a step for preparing a supporting film comprising a number of locations each of which constituting a card support and being provided with a cavity capable of receiving an integrated circuit, a step for processing this supporting film carried out, in part, by a multi-head tool, one of the heads of this tool being provided for carrying out an operation on a location of the film essentially at the same time as another head of this tool carries out the same operation on another location of this film, and a step for separating the locations after the processing step.

Abstract: An electronic entity (2) includes an electronic circuit (4) having connected thereto an antenna. The antenna includes a loop (6) electrically connected to the electronic circuit (4) and a resonator (8) coupled with the loop (6). The resonator (8) can be capacitively coupled to the loop. The resonator can be formed from a turn facing the loop (6) over at least a portion of its perimeter.

Abstract: Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (32), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.

Abstract: An electronic entity (2) includes an electronic circuit (4) having connected thereto an antenna. The antenna includes a loop (6) electrically connected to the electronic circuit (4) and a resonator (8) coupled with the loop (6).

Abstract: Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (32), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.

Abstract: A method for producing a number of chip cards includes a step for preparing a supporting film comprising a number of locations each of which constituting a card support and being provided with a cavity capable of receiving an integrated circuit, a step for processing this supporting film carried out, in part, by a multi-head tool, one of the heads of this tool being provided for carrying out an operation on a location of the film essentially at the same time as another head of this tool carries out the same operation on another location of this film, and a step for separating the locations after the processing step.

Abstract: The invention concerns a foldable document comprising a support (10) provided with first and second parts (12, 14) adapted to pivot relative to each other about a folding axis (16) along the edges of (18, 20) of said parts and a non-contact electronic device (1) mounted in the first part (12) of the support and comprising an electronic microcircuit (3) and an antenna (2) electrically connected to said electronic microcircuit (3), and adapted to be (electro)magnetically coupled with an external reading station (5).