Patents by Inventor Guy Frick

Guy Frick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9426898
    Abstract: A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 23, 2016
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Guy Frick, Thomas J. Colosimo, Jr., Horst Clauberg
  • Publication number: 20150382480
    Abstract: A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.
    Type: Application
    Filed: June 25, 2015
    Publication date: December 31, 2015
    Inventors: Guy Frick, Thomas J. Colosimo, JR., Horst Clauberg
  • Publication number: 20070216431
    Abstract: A method and apparatus for performing automated alignment of probes of a probe card is provided. The desired horizontal location for a probe is compared with the actual horizontal position for the probe to determine a horizontal correction distance and a horizontal correction direction to correct a horizontal alignment for the probe. A first tool automatically corrects the horizontal alignment for the probe based on the horizontal correction distance and the horizontal correction direction. Upon determining that an actual vertical position of the probe is closer to the probe card than a desired vertical position, a second tool automatically changes the actual vertical position of the probe to the desired vertical position. Upon determining that the actual vertical position of the probe is farther from the probe card than the desired vertical position, a third tool automatically changes the actual vertical position of the probe to the desired vertical position.
    Type: Application
    Filed: February 7, 2007
    Publication date: September 20, 2007
    Inventors: Bahadir Tunaboylu, Guy Frick, Edward Malantonio, Horst Clauberg, John McGlory
  • Publication number: 20060043995
    Abstract: A probe for a probe card assembly is provided. The probe includes a beam element having a tip end portion. The probe also includes a tip structure on the tip end portion of the beam element. The tip structure includes a plurality of conductive bumps arranged in a stacked configuration.
    Type: Application
    Filed: August 25, 2005
    Publication date: March 2, 2006
    Inventors: Scott Williams, John Shuhart, Alan Slopey, Guy Frick