Abstract: Some embodiments of the present disclosure are directed to wafer alignment in multiple dies. For example, a receptacle wafer and a photonic wafer may be prepared containing a plurality of individual dies. Further, these two wafers may be aligned, wafer bonded, and cut into the individual dies. Additionally, or alternatively, these individual dies may be ready to be attached to a substrate and require no further alignment. The method of the present disclosure may be (i) cost effective since a single, passive receptacle wafer alignment results in multiple dies, (ii) repeatable (e.g., less variance in production) since it utilizes silicon lithography alignment features and scalable silicon WOW assembly, and (iii) improve optical performance since the thin receptacle wafer has a lower height resulting in a shorter optical path.

Abstract: A device includes a display, a controller configured to control the display, a sensor integrated with the display and a circuit a circuit in communication with the sensor. The sensor is configured to sense touch input and the circuit is configured to detect when a user is gripping the device only based on output from the sensor and a pre-defined model. Gripping is reported to the controller.

Abstract: A device includes a display, a controller configured to control the display, a sensor integrated with the display and a circuit a circuit in communication with the sensor. The sensor is configured to sense touch input and the circuit is configured to detect when a user is gripping the device only based on output from the sensor and a pre-defined model. Gripping is reported to the controller.