Abstract: A multi-layer resist process is used to define a sacrificial host structure used to produce a molecular ruler useful for defining structures via a lift-off type process. By using this process, the removal of the host structure is significantly simplified, and a structure is formed which is perfect for achieving a reproducible high yield lift-off. Moreover, the processes disclosed are completely compatible with volume IC manufacturing processes, and uses a minimum of the organic material which, in a high volume production application, will dramatically reduce solution depletion.

Abstract: Using polymeric dielectric materials (preferably materials derived from bisbenzocyclobutene monomers) and an electron beam lithography process for patterning this material, we have developed a process for fabricating optical waveguides with complex integrated devices such as gratings. Such gratings are not limited to one-dimensional type gratings but can include 2 dimensional gratings such as curved gratings or photonic crystals. Due to the properties of BCB, this process could also be implemented using optical photolithography depending upon the waveguide dimensions desired and the grating dimensions desired. Alternatively, the optical waveguide could be patterned using optical lithography and the grating can be patterned using electron beam lithography. Gratings with much more dimensional precision can be fabricated using electron beam lithography.

Abstract: A method of fabricating a pattern on a surface of a substrate includes applying at least one non-molecular lithographic technique with at least one molecular lithographic technique to simultaneously define a size and shape of at least one of the features of the pattern. The pattern includes a nanoscale gap between features, the gap having a width defined by the thickness of one or more molecular layers used in one of the molecular lithographic techniques.

Abstract: A packaging platform, and method for producing the platform, for integrating, aligning and securing two or more optical, optoelectronic and/or electronic components is provided. The platform provides features for positioning the these elements in the x, y and z directions. This platform can simplify the coupling of light from an optical or optoelectronic component to another optical or optoelectronic component or simplify the electrical coupling from an electronic or optoelectronic component to another electronic or optoelectronic component. This platform can also serve as the final packaging structure, which can be sealed or unsealed, for the integrated, aligned and/or secured optical, optoelectronic and electronic components, where said structure includes any required or desired optical, electrical and/or mechanical features.