Patents by Inventor Guy Lepage

Guy Lepage has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260259371
    Abstract: The present disclosure provides an integrated photonic chip for optical coupling. The photonic chip includes a substrate, a spot size converter formed on a frontside surface of the substrate, a mirror formed on the frontside surface of the substrate, and a meta-lens formed in or on a backside surface of the substrate. The spot size converter enlarges a diameter of a light beam in the photonic chip from a smaller mode size to a larger mode size. The mirror receives the larger mode size light beam from the spot size converter, and reflects the light beam at an angle into the substrate. The meta-lens collimates the light beam reflected by the mirror and expanded, when passing through the substrate, and outputs the collimated light beam towards the optical device.
    Type: Application
    Filed: February 27, 2026
    Publication date: September 3, 2026
    Inventors: Cheng-Jhih Luo, Chia-Ning Weng, Joris Van Campenhout, Maumita Chakrabarti, Yosuke Shimura, Guy Lepage