Patents by Inventor Guy Lichtenwalter

Guy Lichtenwalter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6867504
    Abstract: A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: March 15, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Guy Lichtenwalter, Norman D. Marschke
  • Publication number: 20040026120
    Abstract: A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.
    Type: Application
    Filed: July 7, 2003
    Publication date: February 12, 2004
    Inventors: Guy Lichtenwalter, Norman D. Marschke
  • Patent number: 6612023
    Abstract: A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: September 2, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Guy Lichtenwalter, Norman D. Marschke
  • Patent number: 6301106
    Abstract: The invention provides a single docking station structure which is usable for a set of different pieces of equipment having essentially similar interfaces, such as a manufacturer's line of portable (“notebook” or “laptop”) computer product models. A common first module supports interfaces with peripheral devices or the like. A model-specific second module, second from a set of second modules that correspond with various models from the line of portable computers, is coupled with the first module to support the portable computer. The second module supports the portable computer, so as to interface it directly with the interface on the first module. The second modules, preferably configured as trays for holding the portable computers, are very simple and inexpensive to manufacture. The trays can be stored next to the docking station (like magazines on a bookshelf).
    Type: Grant
    Filed: October 26, 1998
    Date of Patent: October 9, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Jacques H. Helot, Jaime Segura, Guy Lichtenwalter, Michael D. Derocher, Gerald W. Steiger, Masahiko Muranami
  • Patent number: 5055061
    Abstract: A card guide for positioning a circuit card relative to a backplane is disclosed. The card guide provides electrical contacts to a ground plane on the circuit card in addition to positioning the card. The card guide utilizes two types of protuberances to reduce the force needed when the card is inserted or removed from the card guide, while providing accurate mating of paired connectors.
    Type: Grant
    Filed: August 27, 1990
    Date of Patent: October 8, 1991
    Assignee: Hewlett-Packard Company
    Inventor: Guy Lichtenwalter