Abstract: Both a system and method is provided for implementing a wiring change with respect to an electrical component detachably connected to a solderless PWB module. The system comprises at least one unused via on the PWB, an insulator used for electrically disconnecting a selected contact pad of the component from a contact pad disposed on the PWB, and a metallic strip mounted on a substrate for electrically connecting the selected component contact pad to the unused via. In one embodiment of the system, the substrate used to support the conductive strip is the compliant, insulative sheet material used in the interface that normally interconnects the pads of the electrical component with the pads of the PWB module. Alternatively, a separate "smart" layer formed from a thin insulative sheet material may be used to support the conductive strip.