Patents by Inventor Guy NESHER

Guy NESHER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12238862
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Grant
    Filed: May 30, 2024
    Date of Patent: February 25, 2025
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 12109754
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Grant
    Filed: November 9, 2023
    Date of Patent: October 8, 2024
    Assignee: IO TECH GROUP LTD.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20240324101
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Application
    Filed: May 30, 2024
    Publication date: September 26, 2024
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 12089328
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.
    Type: Grant
    Filed: October 31, 2023
    Date of Patent: September 10, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 12046575
    Abstract: A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: July 23, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Patent number: 12013337
    Abstract: An example apparatus for determining dryness of an agent on print media includes an infrared prism, a source of infrared radiation to direct infrared radiation into the infrared prism, and a detector. The infrared prism includes a surface, the surface having an outer side to contact a portion of the agent on the print media, the infrared prism having a refractive index that is higher than a refractive index of the agent. The source of infrared radiation is to direct infrared radiation into the infrared prism and onto an inner side of the surface. The detector is to generate a signal based on infrared radiation reflected by the inner side of the surface to indicate the dryness of the portion of the agent.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: June 18, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Noam Meyuhas, Guy Nesher, Eviatar Golan
  • Patent number: 12010800
    Abstract: In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: June 11, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20240075679
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20240064897
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 11872750
    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital heat source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.
    Type: Grant
    Filed: May 1, 2023
    Date of Patent: January 16, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
  • Patent number: 11877398
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: January 16, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Guy Nesher
  • Patent number: 11865767
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: January 9, 2024
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Patent number: 11860557
    Abstract: In an example, a print apparatus comprises an intermediate transfer member to receive thermoplastic print agent from a photoconductive surface, a rotatably mounted endless cleaning surface to receive a layer of thermoplastic print agent from the intermediate transfer member and a heater, to heat the endless cleaning surface. The endless cleaning surface may be to engage with the intermediate transfer member when heated to transfer residue from the intermediate transfer member to the layer of thermoplastic print agent on the endless cleaning surface.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: January 2, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Amir Kedem, Michael Kokotov, Elina Ploshnik, Guy Nesher, Alex Feygelman, Eran Shiran, Nadav Shalem, Chen Talmor
  • Publication number: 20230294353
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Application
    Filed: April 20, 2023
    Publication date: September 21, 2023
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20230264416
    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital heat source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.
    Type: Application
    Filed: May 1, 2023
    Publication date: August 24, 2023
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
  • Publication number: 20230240022
    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (e.g., epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4). The jet printing unit can also be used for sintering and/or ablating materials. Printed materials are cured by heat or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventors: Ralph S. Birnbaum, Guy Nesher, Alexander Slavomir Stepinski, Michael Zenou
  • Patent number: 11697166
    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: July 11, 2023
    Assignee: IO TECH GROUP LTD.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Patent number: 11697245
    Abstract: Methods and apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials at high resolution. A material is coated on a film non-digitally, excess material is removed digitally, by laser, leaving an image of a layer to be printed, and the image is then engaged with existing portions of an object being fabricated and exposed to a non-digital UV curing light source. Since the only part of the process that is digital is the material removal, and this part is done by laser, the speed of printing and the robustness of the manufacturing process is improved significantly over conventional additive or 3D fabrication techniques.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: July 11, 2023
    Assignee: IO Tech Group Ltd.
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher
  • Patent number: 11691332
    Abstract: Systems and methods in which a material or materials (e.g., a viscous material) are printed or otherwise transferred onto an intermediate substrate at a printing unit(s). The intermediate substrate having an image of material printed thereon is subsequently transferred to a sample building unit, and the image of material is transferred from the intermediate substrate to a sample at the sample building unit. Optionally, the printing unit(s) includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred from the donor substrate onto the intermediate substrate at the printing unit(s). Each of the printing units may employ a variety of printing or other transfer technologies. The system may also include material curing, heating, sintering, ablating, material filling, imaging and cleaning units to aid in the overall process.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: July 4, 2023
    Assignee: IO Tech Group Ltd.
    Inventors: Michael Zenou, Ziv Gilan, Guy Nesher
  • Publication number: 20230202098
    Abstract: In systems for printing a viscous material, the printing and post processing of the viscous material are performed sequentially one after another. In an initial step, a viscous material is printed on a sample mounted on a receiver substrate using a donor module and a laser scanner, and then the donor module is replaced with a post processing system for performing a post processing operation (and vice versa). Multiple post processing operations can be performed, and multiple different materials can be printed on the same layer. The systems can increase the speed, resolution and diversity of materials printed on the same sample, and opens the possibilities for new designs.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 29, 2023
    Inventors: Ziv Gilan, Michael Zenou, Guy Nesher