Patents by Inventor Guy P. Nguyen

Guy P. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible interpenetrating networks formed by epoxy-cyanate ester compositions via a polyamide
    Patent number: 5912316
    Abstract: A resin composition, for use as a die attach adhesive, heat sink attach adhesive, encapsulant or underfill, comprises a resin system, including a mixture of an epoxy resin and a cyanate ester resin, and a polyamide catalyst. The composition is curable in one minute at 200.degree. C. and has a pot life of at least 18 hours at room temperature. The resin composition is flexible, develops high adhesion, high moisture resistance, low weight loss during curing and requires no solvents.
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: June 15, 1999
    Assignee: Johnson Matthey, Inc.
    Inventors: Guy P. Nguyen, Carl Edwards