Abstract: Light-emitting diode (LED) packages and more particularly LED packages with lead frame structures for flip-chip mounting of LED chips are disclosed. Lead frame structures include multiple leads with arrangements for LED chips to be flip-chip mounted across neighboring pairs of leads. Arrangements of stress relief features and anchoring features relative to mounting locations are provided in lead frame structures to enhance mechanical integrity of flip-chip bonds during thermal cycling. LED packages may further include housings that are formed about the lead frame structures. Housings may include a recess with recess floor arrangements for positioning of LED chips.

Abstract: Light-emitting diode (LED) arrays, and more particularly high power LED arrays and related devices are disclosed. Exemplary lighting devices with arrangements of LED chips and/or lumiphoric materials are capable of dynamically providing different color points and/or light outputs. Devices include individually controllable LED chips arranged on a common submount that may include integrated control circuitry for controlling operation of the LED chips. LED chips may be arranged to form sub-arrays of like-colored LED chips and corresponding electrical connections may include one or more shared electrical contacts. Certain aspects relate to arrangements where electrical connections are provided on opposite faces of submounts from the LED chips such that an increased density of LED chips may be arranged along primary emission faces.