Abstract: An embodiment of the present invention is a business process shared services system and method for improving business operations by collaboratively managing operational support services, functions and/or resources. This is accomplished by employing a collaborative shared services business system strategy containing some of the key business model advantages of shared service functions, outsourced services, collective approach, cooperatives, and mutual funds. The collaborative shared services business system (System) is engaged in managing business support operations, functions, services or resources at a lower cost and higher performance to maximize profitability.

Abstract: A method of storing data on a peripheral rotating disk memory system, which is connected to one of a plurality of central processor units via a common bus including temporarily storing, in an intermediate memory system connected to the bus, original data packets which are to be stored in the disk memory system separating data block and commands of the original data packets received by the intermediate memory system from each other, creating composite data packets containing a new command and all data of a number of original data packets received by the intermediate memory system, writing the composite data packets via the bus on the rotating disk memory device, and purging the intermediate memory system after completing a write operation.

Abstract: A very large scale multicell integrated circuit is provided with significantly improved circuit density. Both active and passive circuit elements are formed in a semiconductor substrate using ordinary diffusion techniques. Connectors, preferably made of polysilicon material, are then formed on the surface of the substrate. The connectors have bonding pad areas located along predetermined lines where metal connectors of later-formed metallization layers can be located. Some of the connectors have bonding pad areas connected to circuit elements while others are left unconnected. The subsequently formed metallization layers can then be used to connect together various ones of the circuit elements and multiple ones of the cells together in any desired circuit configuration using the polysilicon connectors.

Abstract: A communication circuit for transmitting multi-bit digital signals from one integrated circuit to another upon a single conductor utilizing a multi-level analog signal. The transmitting circuitry includes first through third drivers, only one of which is activated at any one time. The collector of an output transistor of a first of the drivers is coupled directly to the single bus conductor, the collector of an output transistor of the second driver is coupled to the bus through a single transistor, and the collector of an output transistor of the third driver is coupled to the bus through two series-connected diodes. The receiving circuitry is composed of three receivers, each including an input and output transistor pair coupled in a Darlington configuration.