Abstract: A thermal control system that includes a combination of active and passive components is described herein. In one or more implementation, the thermal control system compensates for non-uniformities in a temperature profile for an arrangement of components within a computing device. One or more active components of the thermal control system transfer heat away from heat-generating devices by active means, such as active transfer to a moving fluid that is driven by a blower or fan. Additionally, one or more passive components are positioned to transfer heat to selected areas of the device using passive transfer devices, such as heat-pipes and thermal spreaders made of conductive materials. The active and passive components operate together to compensate for temperature variations across the device surfaces, produce a controlled temperature profile having greater uniformity, reduce overall differences in surface temperatures, and provide greater capability for heat dissipation.

Abstract: A component card assembly includes a grooved guide adapted to interengage a component card edge between the card receiving and base ends of a support frame. The guide is fixedly attached to the frame base end and comprises an elastically elongatable section. A lever pivotally mounted on the card engages the guide at the frame card receiving end. The pivoting of the lever into a locked position on the frame elastically elongates the guide whereby the component card is controllably restrained in a home position on the frame.