Patents by Inventor Guy Robichaud

Guy Robichaud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
    Patent number: 6946746
    Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: September 20, 2005
    Assignee: International Business Machines Corporation
    Inventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
  • Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
    Publication number: 20040173893
    Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
    Type: Application
    Filed: March 16, 2004
    Publication date: September 9, 2004
    Applicant: International Business Machines Corporation
    Inventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
  • Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
    Patent number: 6737296
    Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: May 18, 2004
    Assignee: International Business Machines Corporation
    Inventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
  • Method to reduce number of wire-bond loop heights versus the total quanity of power signal rings
    Publication number: 20020145193
    Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
    Type: Application
    Filed: May 29, 2002
    Publication date: October 10, 2002
    Applicant: International Business Machines Corporation
    Inventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud
  • Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings
    Patent number: 6414386
    Abstract: A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: July 2, 2002
    Assignee: International Business Machines Corporation
    Inventors: Frederic Beaulieu, Mark J. Kuzawinski, Stephane Mainville, Sylvain Ouimet, Jean-Guy Quintal, Guy Robichaud