Patents by Inventor Gwan Lee
Gwan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12233560Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a residType: GrantFiled: December 20, 2023Date of Patent: February 25, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Min Sung Ha, Kwang-Jun Kim, Jong Kyu Kim, Hyun-Joong Kim, Jin Ho So, Chi-Gun An, Ki Moon Lee, Hui Gwan Lee, Beom Soo Hwang
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Patent number: 12211846Abstract: A semiconductor device includes a substrate including a first region, and a second region, a first gate structure and a second gate structure on the substrate of the first region, a third gate structure and a fourth gate structure on the substrate of the second region, a first interlayer insulating film on the substrate of the first region and including a first lower interlayer insulating film and a first upper interlayer insulating film, a second interlayer insulating film on the substrate of the second region and including a second lower interlayer insulating film and a second upper interlayer insulating film, a first contact between the first gate structure and the second gate structure and within the first interlayer insulating film, and a second contact formed between the third gate structure and the fourth gate structure and within the second interlayer insulating film.Type: GrantFiled: January 18, 2024Date of Patent: January 28, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Sung Soo Kim, Gi Gwan Park, Jung Hun Choi, Koung Min Ryu, Sun Jung Lee
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Patent number: 12189891Abstract: A gate driving circuit including a driving circuit configured to charge an M node based on a selection signal externally supplied in response to receiving a first carry signal, and charge a Q node with a high voltage responsive to a reset signal and a voltage charged in the M node that corresponds to the selection signal, a node controller configured to control the Q node and a Qb node responsive to driving of the driving circuit, wherein a level of a voltage of the Qb node is opposite to a level of a voltage of the Q node, and an output circuit configured to output a second carry signal and at least one scan signal responsive to voltages at the Q node and Qb node included in the node controller.Type: GrantFiled: July 19, 2023Date of Patent: January 7, 2025Assignee: LG Display Co., Ltd.Inventor: Tae Gwan Lee
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Publication number: 20240338701Abstract: This application relates to a financial payment method using biometric information, in which biometric information of an individual collected in a mobile device of an affiliated member is transmitted to a mobile device of the individual to allow the biometric information to be authenticated in the mobile device of the individual. After the authentication of the biometric information, a substitute key that corresponds to a card password preset by the individual is inputted, and a financial payment is requested based on the payment content.Type: ApplicationFiled: June 18, 2024Publication date: October 10, 2024Applicant: GHOST PASS Inc.Inventors: Seon Gwan LEE, Jun Young KWON
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Publication number: 20240292671Abstract: A display device includes: a substrate having a display area including a subpixel and a non-display area surrounding the display area; a driving transistor and a light emitting diode in the subpixel on the substrate; an overcoat layer between driving transistor and the light emitting diode; and a bank layer on the overcoat layer, wherein in the non-display area, parts of the overcoat layer and the bank layer are removed to form at least one trench.Type: ApplicationFiled: February 24, 2024Publication date: August 29, 2024Inventors: Tae-Gwan LEE, Hong-Jae SHIN, Yong-Ho KIM
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Publication number: 20240265080Abstract: The present invention relates to an electronic device for performing user authentication on a user by using user biometric information in response to a request made by a user authentication request device. The user authentication request device transmits data obtained by sensing the body of a user adjacent thereto to the electronic device (a user authentication device) of the user to request user authentication, and receives authentication result data from the user authentication device.Type: ApplicationFiled: November 8, 2023Publication date: August 8, 2024Applicant: GHOST PASS Inc.Inventor: Seon Gwan LEE
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Publication number: 20240256079Abstract: A gate driving circuit including a driving circuit configured to charge an M node based on a selection signal externally supplied in response to receiving a first carry signal, and charge a Q node with a high voltage responsive to a reset signal and a voltage charged in the M node that corresponds to the selection signal, a node controller configured to control the Q node and a Qb node responsive to driving of the driving circuit, wherein a level of a voltage of the Qb node is opposite to a level of a voltage of the Q node, and an output circuit configured to output a second carry signal and at least one scan signal responsive to voltages at the Q node and Qb node included in the node controller.Type: ApplicationFiled: July 19, 2023Publication date: August 1, 2024Inventor: Tae Gwan LEE
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Patent number: 12051055Abstract: This application relates to a financial payment method using biometric information, in which biometric information of an individual collected in a mobile device of an affiliated member is transmitted to a mobile device of the individual to allow the biometric information to be authenticated in the mobile device of the individual. After the authentication of the biometric information, a substitute key that corresponds to a card password preset by the individual is inputted, and a financial payment is requested based on the payment content.Type: GrantFiled: November 9, 2021Date of Patent: July 30, 2024Assignee: Ghost Pass Inc.Inventors: Seon Gwan Lee, Jun Young Kwon
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Patent number: 12033977Abstract: A semiconductor package is provided. The semiconductor package includes: a substrate; a first buffer chip and a second buffer chip located on an upper part of the substrate; a plurality of nonvolatile memory chips located on the upper part of the substrate and including a first nonvolatile memory chip and a second nonvolatile memory chip, the first nonvolatile memory chip being electrically connected to the first buffer chip, and the second nonvolatile memory chip being electrically connected to the second buffer chip; a plurality of external connection terminals connected to a lower part of the substrate; and a rewiring pattern located inside the substrate. The rewiring pattern is configured to diverge an external electric signal received through one of the plurality of external connection terminals into first and second signals, transmit the first signal to the first buffer chip, and transmit the second signal to the second buffer chip.Type: GrantFiled: March 24, 2023Date of Patent: July 9, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Seong Gwan Lee
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Publication number: 20240202695Abstract: A payment method and a payment system using a user terminal are illustrated. A method for performing payment using a user terminal by a payment system according to an embodiment of the present invention may comprise the steps in which: the user terminal recognizes a product to be purchased; a seller terminal having recognized biometric information of a user transmits the biometric information of the user to the user terminal; the user terminal performs personal authentication according to whether the biometric information of the user received from the seller terminal coincides with biometric information pre-stored in the user terminal; and when the personal authentication is successfully performed on the user terminal, the user terminal performs payment for the product recognized via the user terminal.Type: ApplicationFiled: April 13, 2022Publication date: June 20, 2024Inventors: Seon Gwan LEE, Sin Young PARK
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Publication number: 20240116184Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a residType: ApplicationFiled: December 20, 2023Publication date: April 11, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Min Sung HA, Kwang-Jun KIM, Jong Kyu KIM, Hyun-Joong KIM, Jin Ho SO, Chi-Gun AN, Ki Moon LEE, Hui Gwan LEE, Beom Soo HWANG
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Patent number: 11904480Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a residType: GrantFiled: February 7, 2022Date of Patent: February 20, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Min Sung Ha, Kwang-Jun Kim, Jong Kyu Kim, Hyun-Joong Kim, Jin Ho So, Chi-Gun An, Ki Moon Lee, Hui Gwan Lee, Beom Soo Hwang
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Patent number: 11810114Abstract: This application relates to a financial payment method using biometric information. Biometric information of an individual collected in a mobile device of an affiliated member is transmitted to a mobile device of the individual to allow the biometric information to be authenticated in the mobile device of the individual. After the authentication of the biometric information, a substitute key that corresponds to a card password preset by the individual is inputted, and a financial payment is requested based on the payment content.Type: GrantFiled: December 16, 2021Date of Patent: November 7, 2023Assignee: GHOST PASS Inc.Inventor: Seon Gwan Lee
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Publication number: 20230299289Abstract: The present invention relates to a method for preparing an anode active material and a secondary battery including the anode active material. The anode active material may be prepared by including the steps of: preparing intermediate-stage spheroidized particles by pulverizing and spheroidizing flaky graphite particles; preparing coated particles by mixing the intermediate-stage spheroidized particles with composite particles and performing a mechanochemical reaction thereon to coat the surface of the intermediate-stage spheroidized particles with the composite particles; and spheroidizing the coated particles and coating the surface thereof with amorphous carbon to prepare spherical graphite.Type: ApplicationFiled: July 9, 2021Publication date: September 21, 2023Inventors: Sung Woon YOO, Hyun Ho LEE, Byung Gwan LEE
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Publication number: 20230299290Abstract: The present invention relates to a method for preparing an anode active material including the steps of: obtaining graphite byproduct particles that have not been spheroidized in a step of pulverizing and spheroidizing flaky graphite particles; preparing coated particles by liquid phase mixing the graphite byproduct particles with composite particles to coat the surface of the graphite byproduct particles with the composite particles; spheroidizing the coated particles by performing an isostatic pressing process thereon; and pulverizing the coated particles and coating the surface thereof with amorphous carbon to prepare spherical graphite.Type: ApplicationFiled: July 9, 2021Publication date: September 21, 2023Inventors: Sung Woon YOO, Hyun Ho LEE, Byung Gwan LEE
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Publication number: 20230275225Abstract: The present invention relates to a method for preparing an anode active material and a secondary battery including the anode active material. The anode active material may be prepared by a method including the steps of: obtaining byproduct particles that have not been spheroidized in a step of pulverizing and spheroidizing flaky graphite particles; preparing coated particles by mixing the graphite byproduct particles with composite particles and performing a mechanochemical reaction thereon to coat the surface of the graphite byproduct particles with the composite particles; and spheroidizing the coated particles and coating the surface thereof with amorphous carbon to prepare spherical graphite.Type: ApplicationFiled: July 9, 2021Publication date: August 31, 2023Inventors: Sung Woon YOO, Hyun Ho LEE, Byung Gwan LEE
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Publication number: 20230249350Abstract: An automated gas supply system includes a gas cylinder transfer unit configured to transfer a cradle in which one or more gas cylinders storing a gas therein are stored; a gas cylinder inspection unit configured to check properties of the gas stored in the gas cylinder transferred from the gas cylinder transfer unit and check whether the gas leaks from the gas cylinder; a storage queue configured to receive the gas cylinder from the gas cylinder inspection unit by a mobile robot and configured to classify and store the transferred gas cylinders according to the properties of the gas stored in the gas cylinder; and a gas cabinet configured to receive the gas cylinder from the storage queue by the mobile robot and fasten a gas pipe, which is connected to a semiconductor manufacturing process line, to a gas spray nozzle, which is disposed at one side of the received gas cylinder, to supply the gas stored in the gas cylinder to the semiconductor manufacturing process line, wherein the gas cabinet includes a residType: ApplicationFiled: February 7, 2022Publication date: August 10, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Min Sung HA, Kwang-Jun KIM, Jong Kyu KIM, Hyun-Joong KIM, Jin Ho SO, Chi-Gun AN, Ki Moon LEE, Hui Gwan LEE, Beom Soo HWANG
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Publication number: 20230230956Abstract: A semiconductor package is provided. The semiconductor package includes: a substrate; a first buffer chip and a second buffer chip located on an upper part of the substrate; a plurality of nonvolatile memory chips located on the upper part of the substrate and including a first nonvolatile memory chip and a second nonvolatile memory chip, the first nonvolatile memory chip being electrically connected to the first buffer chip, and the second nonvolatile memory chip being electrically connected to the second buffer chip; a plurality of external connection terminals connected to a lower part of the substrate; and a rewiring pattern located inside the substrate. The rewiring pattern is configured to diverge an external electric signal received through one of the plurality of external connection terminals into first and second signals, transmit the first signal to the first buffer chip, and transmit the second signal to the second buffer chip.Type: ApplicationFiled: March 24, 2023Publication date: July 20, 2023Inventor: Seong Gwan Lee
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Patent number: 11637085Abstract: A semiconductor package is provided. The semiconductor package includes: a substrate; a first buffer chip and a second buffer chip located on an upper part of the substrate; a plurality of nonvolatile memory chips located on the upper part of the substrate and including a first nonvolatile memory chip and a second nonvolatile memory chip, the first nonvolatile memory chip being electrically connected to the first buffer chip, and the second nonvolatile memory chip being electrically connected to the second buffer chip; a plurality of external connection terminals connected to a lower part of the substrate; and a rewiring pattern located inside the substrate. The rewiring pattern is configured to diverge an external electric signal received through one of the plurality of external connection terminals into first and second signals, transmit the first signal to the first buffer chip, and transmit the second signal to the second buffer chip.Type: GrantFiled: September 29, 2020Date of Patent: April 25, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventor: Seong Gwan Lee
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Patent number: 11577364Abstract: A conditioner of a chemical mechanical polishing (CMP) apparatus includes a conditioning part to polish a polishing pad, an arm to rotate the conditioning part, and a flexible connector connecting the conditioning part with the arm, the flexible connector being moveable to allow relative movements of the conditioning part with respect to the arm.Type: GrantFiled: December 19, 2018Date of Patent: February 14, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong-Hee Lee, Seung-Chul Han, Hui-Gwan Lee, Jong-Hwi Seo