Patents by Inventor Gwan Yong LEE

Gwan Yong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRAIN SENSOR, METHOD OF MANUFACTURING STRAIN SENSOR, AND STRAIN MEASURING METHOD USING STRAIN SENSOR
    Publication number: 20240118071
    Abstract: A strain sensor may have a conductive elastic yarn including a first fiber having a predetermined length and a shape of a fiber yarn and a second fiber having electrical conductivity and a sheet shape. The strain sensor may have a pair of wiring members electrically connected to both ends of the conductive elastic yarn. The conductive elastic yarn, with the second fiber wrapped around the first fiber, is twisted in a coil shape.
    Type: Application
    Filed: February 1, 2023
    Publication date: April 11, 2024
    Inventors: Mi Yong Lee, Seong Hyun Son, Moon Young Jung, Jun Ho Song, Jong Seo Kim, Woo Chang Jeong, Gwan Mu Lee, Dong Seok Suh, Feng Wang
  • Camera module
    Patent number: 11405540
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: August 2, 2022
    Inventors: Gwan Yong Lee, Cheol Hwang, Dohyun Ahn
  • CAMERA MODULE
    Publication number: 20190349507
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Application
    Filed: November 16, 2017
    Publication date: November 14, 2019
    Inventors: Gwan Yong LEE, Cheol HWANG, Dohyun AHN