Patents by Inventor Gwan Yong LEE

Gwan Yong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11405540
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: August 2, 2022
    Inventors: Gwan Yong Lee, Cheol Hwang, Dohyun Ahn
  • Publication number: 20190349507
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Application
    Filed: November 16, 2017
    Publication date: November 14, 2019
    Inventors: Gwan Yong LEE, Cheol HWANG, Dohyun AHN