Patents by Inventor Gwan Yong LEE

Gwan Yong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12233099
    Abstract: The present invention relates to a composition for promoting myogenesis, containing, as an active ingredient, a processed ginseng extract in which a trace amount of a ginsenoside ingredient is increased. It has been ascertained that the processed ginseng extract promotes the differentiation of myoblasts into muscle and inhibits muscle atrophy caused by myostatin, which is a myogenesis inhibitory factor, and thus it is expected that a composition for preventing or treating muscle disorder-related diseases, having excellent effects, can be developed.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: February 25, 2025
    Assignee: GREEN CROSS WELLBEING CORPORATION
    Inventors: Sun Kyu Park, Jeom Yong Kim, Young Hyo Yoo, Min Jung Jang, Chang Taek Oh, Min Ju Lim, Gwan Su Yi, Yi Li, Yoon Hyeok Lee, Jae Cheal Yoo
  • Patent number: 11405540
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: August 2, 2022
    Inventors: Gwan Yong Lee, Cheol Hwang, Dohyun Ahn
  • Publication number: 20190349507
    Abstract: A printed circuit board of a camera module according to various embodiments of the disclosure includes: a ground portion constructed on the printed circuit board; a conductive member which is disposed to cover the ground portion and includes a first opening at a location corresponding to the ground portion; and an adhesive layer which is interposed between the printed circuit board and the conductive member and includes a second opening at a location corresponding to the ground portion, wherein the conductive member may be electrically coupled to the ground portion through a solder constructed on the first opening and the second opening. Other embodiments are also possible.
    Type: Application
    Filed: November 16, 2017
    Publication date: November 14, 2019
    Inventors: Gwan Yong LEE, Cheol HWANG, Dohyun AHN