Abstract: Disclosed is a method of operating a storage controller, the storage controller communicating with a host and a non-volatile memory device. The method includes receiving a first erase request from the host, the first erase request being for a first zone of a plurality of zones of the non-volatile memory device, loading first allocation list information of the first zone from an allocation list table based on the first erase request, deallocating memory blocks allocated to the first zone based on the first allocation list information, wherein sequential physical page numbers of the memory blocks are respectively mapped onto sequential logical page numbers, and providing the non-volatile memory device with a physical erase request for the deallocated memory blocks of the first zone.

Abstract: A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.

Abstract: A virtual machine placement system for placing a plurality of virtual machines on a first physical server and a second physical server in order to efficiently operate a physical server in which the plurality of virtual machines are installed is provided. The physical server includes the first physical server and the second physical server. The virtual machine placement system includes a workload calculation module; a prediction module; a temperature prediction module; a schedule module; and a migration module. The schedule module calculates a placement schedule considering a predicted temperature of the physical server.

Abstract: The present disclosure relates to a method for manufacturing a spicule capable of promoting percutaneous absorption of skin improvement active ingredients and fine diamonds, a spicule manufactured thereby, and a cosmetic composition comprising the same. A spicule cosmetic composition prepared according to the present disclosure can be used in the preparation of a cosmetic composition that may have excellent percutaneous penetration efficacy and may be excellent in functionality.

Abstract: Provided are an organic electronic element and an electronic device therefor, wherein the organic electronic element has a mixture of a compound according to the present invention used as material for an organic layer thereof, thereby enabling the achievement of high light-emitting efficiency and low driving voltage of the organic electronic element, and enabling the life of the element to be greatly extended.

Abstract: The present invention relates to a compound for an organic electric element, an organic electric element using same, and an electronic device thereof. According to the present invention, high light-emitting efficiency, low driving voltage, and high heat resistance can be achieved in the element, and the color purity and lifespan of the element can be improved.

Abstract: A thin film transistor according to an exemplary embodiment of the present invention includes an oxide semiconductor. A source electrode and a drain electrode face each other. The source electrode and the drain electrode are positioned at two opposite sides, respectively, of the oxide semiconductor. A low conductive region is positioned between the source electrode or the drain electrode and the oxide semiconductor. An insulating layer is positioned on the oxide semiconductor and the low conductive region. A gate electrode is positioned on the insulating layer. The insulating layer covers the oxide semiconductor and the low conductive region. A carrier concentration of the low conductive region is lower than a carrier concentration of the source electrode or the drain electrode.

Abstract: An apparatus for multi-label class classification based on a coarse-to-fine convolutional neural network includes: a processor; and a memory connected to the processor, in which the memory stores program instructions executed by the processor to generate a plurality of hierarchical structure based group labels for a plurality of classes to be classified by using a disjoint grouping method, predict classes which belong to the plurality of group labels, respectively among the plurality of classes by using a coarse-to-fine convolutional neural network including a main network and one or more subnetworks, complete learning of the coarse-to-fine convolutional network through the prediction, and classify one or more classes included in the image by receiving a feature map input from a last convolutional layer of the one or more subnetworks by the main network of the coarse-to-fine convolutional neural network of which learning is completed.

Abstract: Provided is a virtual machine (VM) management method of simulating a change in deployment of VMs deployed on physical servers including a first physical server and a second physical server physically separated from the first physical server and scheduling deployment of VMs and predicting workload of VMs.

Abstract: A semiconductor package comprises: a package substrate comprising: a first portion comprising a first conductive pattern extending therewithin having a first thickness; and a second portion comprising a second conductive pattern extending therewithin having a second thickness smaller than the first thickness; at least one electronic component mounted on the second portion and electrically coupled to the second conductive pattern; an encapsulant layer formed on the second portion of the package substrate and covering the at least one electronic component, wherein the encapsulant layer comprises a cavity region; a connector assembly formed within the cavity region of the encapsulant layer and electrically coupled to the second conductive pattern, wherein the connector assembly is exposed from the encapsulant layer to allow for electrical connection with an external device; and a partial shielding layer formed on at least regions other than the cavity region of the encapsulant layer.

Abstract: A display substrate includes a substrate, a first gate electrode on the substrate, a first gate insulating layer on the first gate electrode, an active layer on the first gate insulating layer, a second gate insulating layer on the active layer, a second gate electrode on the second gate insulating layer, an interlayer insulating layer on the second gate electrode, a first electrode on the interlayer insulating layer to contact a top surface, a side wall, and a bottom surface of the active layer via a first contact hole through the interlayer insulating layer, the second gate insulating layer, the active layer, and a portion of the first gate insulating layer, and a second electrode on the interlayer insulating layer to contact the first gate electrode via a second contact hole through the interlayer insulating layer, the second gate insulating layer, and the first gate insulating layer.

Abstract: Provided are an organic electric element having a first electrode, a second electrode, and at least an organic material layer formed between the first electrode and the second electrode, the organic material layer comprising an emitting layer and the emitting layer comprising a mixture of host materials which improves luminous efficiency, stability, and lifespan of the element; and an organic electronic device comprising the element.

Abstract: A self-cleaning device and a method of operating the same for removing droplet, high viscosity liquid material or mixed material using heating, multi-voltage applying or vibration are disclosed. The self-cleaning device comprises a metal material layer disposed on a solid material layer and a hydrophobic layer disposed on the metal material layer. The metal material layer includes a view member formed of conductive material and a heating member disposed outside or inside the view member, heat is generated from the view member and the heating member when a power is applied to the view member and the heating member, the heat generated from the heating member is delivered to the view member, and droplet existed on a surface of the self-cleaning device is removed or a volume or surface tension of the droplet reduces by the heat generated from the view member and the heat delivered from the heating member.

Abstract: A semiconductor device has a substrate and a first component disposed over a first surface of the substrate. A connector is disposed over the first surface of the substrate. A first encapsulant is deposited over the first component while the connector remains outside of the first encapsulant. A shielding layer is formed over the first encapsulant while the connector remains outside of the shielding layer. A second component is disposed over a second surface of the substrate. A solder bump is disposed over the second surface of the substrate. A second encapsulant is deposited over the second surface of the substrate. An opening is formed through the second encapsulant to expose the solder bump. A solder ball is disposed in the opening. The solder ball and solder bump are reflowed to form a combined solder bump.

Abstract: A semiconductor device has a substrate and an electrical component disposed over a surface of the substrate. An antenna interposer is disposed over the substrate. A first encapsulant is deposited around the antenna interposer. The first encapsulant has a high dielectric constant. The antenna interposer has a conductive layer operating as an antenna and an insulating layer having a low dielectric constant less than the high dielectric constant of the first encapsulant. The antenna interposer is made from an antenna substrate having a plurality of antenna interposers. Bumps are formed over the antenna substrate and the antenna substrate is singulated to make the plurality of antenna interposers. A second encapsulant is deposited over the electrical component. The second encapsulant has a low dielectric constant less than the high dielectric constant of the first encapsulant. A shielding layer is disposed over the second encapsulant.

Abstract: A display apparatus according to a concept of the disclosure includes: a display panel configured to display an image in a front direction; a top chassis positioned in a front direction of the display panel; a bottom chassis positioned in a rear direction of the display panel; a rear cover covering a rear side of the bottom chassis; and a stand member being accommodatable in the rear cover and selectively coupled with a rear surface of the rear cover, wherein the rear cover includes an accommodating portion in which the stand member is accommodated and a coupling portion coupled with the stand member, and the stand member includes an inserting protrusion which is inserted into the accommodating portion and the coupling portion.