Patents by Inventor Gwang Kim, Jr.

Gwang Kim, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked integrated circuit package-in-package system
    Patent number: 7420269
    Abstract: A stacked integrated circuit package-in-package system is provided forming a first integrated circuit package having a first peripheral contact, forming a second integrated circuit package having a second peripheral contact, stacking the second integrated circuit package on the first integrated circuit package in an offset configuration with the first peripheral contact exposed, the offset configuration provides a second package overhang with the second integrated circuit package above the first integrated circuit package, electrically connecting the first peripheral contact and a package substrate top contact, and electrically connecting the second peripheral contact and the package substrate top contact.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: September 2, 2008
    Assignee: Stats Chippac Ltd.
    Inventors: Jong-Woo Ha, Gwang Kim, Jr., Ju Hyun Park