Patents by Inventor Gwang-we YOO

Gwang-we YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing integrated circuit device
    Patent number: 10795262
    Abstract: A method of manufacturing an integrated circuit (IC) device includes exposing a partial region of a photoresist film formed on a main surface of a substrate to generate acid, and diffusing the acid in the partial region of the photoresist film. Diffusing the acid may include applying an electric field, in a direction perpendicular to a direction in which the main surface of the substrate extends, to the photoresist film using an electrode facing the substrate through an electric-field transmission layer filling between the photoresist film and the electrode. The electric-field transmission layer may include an ion-containing layer or a conductive polymer layer.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: October 6, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., Research & Business Foundation SUNGYUNKWAN UNIVERSITY
    Inventors: Jin Park, Sang Ki Nam, Kyu-hee Han, Jin-ok Kim, Jin-hong Park, Gwang-we Yoo
  • METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE
    Publication number: 20190287792
    Abstract: A method of manufacturing an integrated circuit (IC) device includes exposing a partial region of a photoresist film formed on a main surface of a substrate to generate acid, and diffusing the acid in the partial region of the photoresist film. Diffusing the acid may include applying an electric field, in a direction perpendicular to a direction in which the main surface of the substrate extends, to the photoresist film using an electrode facing the substrate through an electric-field transmission layer filling between the photoresist film and the electrode. The electric-field transmission layer may include an ion-containing layer or a conductive polymer layer.
    Type: Application
    Filed: October 19, 2018
    Publication date: September 19, 2019
    Applicant: Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Jin PARK, Sang Ki NAM, Kyu-hee HAN, Jin-ok KIM, Jin-hong PARK, Gwang-we YOO