Patents by Inventor Gwang-Weon Yu

Gwang-Weon Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250171905
    Abstract: The disclosure relates to a steel wire and a spring having excellent antibacterial properties and corrosion resistance, and methods of manufacturing the same. The steel wire having excellent antibacterial properties and corrosion resistance includes: a steel wire; and a plating layer formed on the steel wire, wherein the plating layer includes a zinc (Zn)-aluminum (Al) plating layer plated on a surface of the steel wire, and a doping layer formed by doping a surface of the Zn—Al plating layer with a metal in a colloidal form. The method of manufacturing the steel wire having excellent antibacterial properties and corrosion resistance includes forming a plating layer on a surface of a steel wire, wherein the forming of the plating layer includes forming a Zn—Al plating layer by plating the surface of the steel wire, and forming a doping layer by doping a surface of the Zn—Al plating layer with a metal in a colloidal form.
    Type: Application
    Filed: February 2, 2023
    Publication date: May 29, 2025
    Applicants: Kiswire Ltd., Scherdel Innotec Forschungs- Und Entwicklungs- GmbH
    Inventors: Gwang Weon Yu, Wolf-Thilo Zaumseil, Martin Guenthner
  • Publication number: 20240093341
    Abstract: A plated steel wire, according to one aspect of the present invention, comprises: a base steel wire; and a zinc alloy plated layer. The zinc alloy plated layer comprises, in percentage by weight: 1.0% to 3.0% of AI; 1.0% to 2.0% of Mg; 0.5% to 5.0% of Fe; and the balance being Zn and unavoidable impurities, and includes a Zn/MgZn2/AI ternary eutectic structure, a Zn single-phase structure, and an Fe—Zn-AI-based crystal structure, wherein the Fe—Zn-AI-based crystal structure is formed adjacent to the base steel wire, and can have an average thickness of ? to ½ with respect to an average thickness of the zinc alloy plated layer.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Applicants: POSCO CO., LTD, KISWIRE LTD., HONGDUK INDUSTRIAL CO., LTD.
    Inventors: Tae-Chul Kim, Jong-Sung Kim, Sung-Hoon Kang, Gwang-Weon Yu, Il-Ryoung Sohn, Jong-Sang Kim
  • Patent number: 11834747
    Abstract: A plated steel wire, according to one aspect of the present invention, comprises: a base steel wire; and a zinc alloy plated layer. The zinc alloy plated layer comprises, in percentage by weight: 1.0% to 3.0% of Al; 1.0% to 2.0% of Mg; 0.5% to 5.0% of Fe; and the balance being Zn and unavoidable impurities, and includes a Zn/MgZn2/Al ternary eutectic structure, a Zn single-phase structure, and an Fe—Zn—Al-based crystal structure, wherein the Fe—Zn—Al-based crystal structure is formed adjacent to the base steel wire, and can have an average thickness of ? to ½ with respect to an average thickness of the zinc alloy plated layer.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: December 5, 2023
    Assignees: POSCO CO., LTD, KISWIRE LTD., HONGDUK INDUSTRIAL CO., LTD.
    Inventors: Tae-Chul Kim, Jong-Sung Kim, Sung-Hoon Kang, Gwang-Weon Yu, Il-Ryoung Sohn, Jong-Sang Kim
  • Publication number: 20220251695
    Abstract: A plated steel wire, according to one aspect of the present invention, comprises: a base steel wire; and a zinc alloy plated layer. The zinc alloy plated layer comprises, in percentage by weight: 1.0% to 3.0% of AI; 1.0% to 2.0% of Mg; 0.5% to 5.0% of Fe; and the balance being Zn and unavoidable impurities, and includes a Zn/MgZn2/AI ternary eutectic structure, a Zn single-phase structure, and an Fe—Zn-AI-based crystal structure, wherein the Fe—Zn-AI-based crystal structure is formed adjacent to the base steel wire, and can have an average thickness of ? to ½ with respect to an average thickness of the zinc alloy plated layer.
    Type: Application
    Filed: June 26, 2019
    Publication date: August 11, 2022
    Applicants: POSCO, KISWIRE LTD., HONGDUK INDUSTRIAL CO., LTD.
    Inventors: Tae-Chul Kim, Jong-Sung Kim, Sung-Hoon Kang, Gwang-Weon Yu, Il-Ryoung Sohn, Jong-Sang Kim