Abstract: A substrate bonding apparatus includes a first bonding chuck having a first base, a deformable plate on the first base to support a first substrate, and a lower pressurer under the first base to apply pressure to the deformable plate, and a second bonding chuck vertically spaced apart from the first bonding chuck and having a second base to fix a second substrate, and an upper pressurer to apply pressure to the second substrate. The deformable plate includes an outer portion surrounding a center portion, a bottom surface of the outer portion of the deformable plate being adhered to the first base, the center portion being deformable in the vertical direction by the lower pressurer, and thicknesses of the center and outer portions of the deformable plate in the vertical direction being different from each other.

Abstract: A wafer bonding apparatus includes lower and upper stages, lower and upper push rods, a position detection sensor, and processing circuitry. The stages may vacuum suction respective wafers on respective surfaces of the stages based on a vacuum pressure being supplied to respective suction holes in the respective surfaces from a vacuum pump. The push rods are movable through respective center holes in the stages to apply pressure to respective middle regions of the respective wafers. The position detection sensor may generate information indicating a bonding propagation position of the wafers based on detecting at least one wafer through a detection hole in at least one stage. The processing circuitry may process the information to detect the bonding propagation position and cause a change of at least one of a ratio of protruding lengths of the push rods, or a ratio of suction areas of the stages.

Abstract: A semiconductor substrate alignment device includes: a lower chuck; a lower chuck driving unit; an upper chuck above and overlapping the lower chuck; observation windows in the upper chuck, imaging units respectively configured to irradiate light through the observation windows and to obtain images by detecting light reflected from the semiconductor substrates; a distance sensor configured to detect a distance between an edge of the lower chuck and an edge of the upper chuck; and a control unit configured to identify first and second alignment keys from images of first and second semiconductor substrates, determine an alignment error value of the first and second semiconductor substrates, and compensate for the alignment error value by driving the lower chuck driving unit.

Abstract: In a wafer to wafer bonding method, a first wafer is vacuum suctions on a first surface of a lower stage and a second wafer is vacuum suctioned on a second surface of an upper stage. Pressure is applied to a middle portion of the first wafer by a lower push rod and pressure is applied to a middle portion of the second wafer by an upper push rod. Bonding of the first and second wafers propagates radially outwards. A bonding propagation position of the first and second wafers is detected. A ratio of protruding lengths of the lower push rod and the upper push rod is changed according to the bonding propagation position.