Patents by Inventor Gwo-Ji Horng

Gwo-Ji Horng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
    Patent number: 7222419
    Abstract: A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal conductive openings. The green tapes are stacked together so that the metal paste inside the conductive openings and the thermal conductive openings of every green tape is in contact respectively with its neighboring metal paste within the conductive openings and thermal conductive openings of the green tapes. Cofire those green tapes and the metal paste to form a pre-substrate. The pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: May 29, 2007
    Assignee: Chung-Shan Institute of Science and Technology
    Inventors: Gwo-Ji Horng, Jen-I Kuo, Feng-Ger Hsiau
  • Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
    Publication number: 20040045656
    Abstract: A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal conductive openings. The green tapes are stacked together so that the metal paste inside the conductive openings and the thermal conductive openings of every green tape is in contact respectively with its neighboring metal paste within the conductive openings and thermal conductive openings of the green tapes. Cofire those green tapes and the metal paste to form a pre-substrate. The pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs.
    Type: Application
    Filed: August 8, 2003
    Publication date: March 11, 2004
    Inventors: Gwo-Ji Horng, Jen-I Kuo, Feng-Ger Hsiau
  • Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package
    Publication number: 20030110629
    Abstract: A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal conductive openings. The green tapes are stacked together so that the metal paste inside the conductive openings and the thermal conductive openings of every green tape is in contact respectively with its neighboring metal paste within the conductive openings and thermal conductive openings of the green tapes. Cofire those green tapes and the metal paste to form a pre-substrate. The pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs.
    Type: Application
    Filed: December 19, 2001
    Publication date: June 19, 2003
    Inventors: Gwo-Ji Horng, Jen-I Kuo, Feng-Ger Hsiau