Patents by Inventor Gwun-Jin Lin

Gwun-Jin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10980113
    Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: April 13, 2021
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Chih-Heng Chuo, Gwun-Jin Lin
  • Publication number: 20200170109
    Abstract: A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.
    Type: Application
    Filed: May 15, 2019
    Publication date: May 28, 2020
    Inventors: KUO-FU SU, CHIH-HENG CHUO, GWUN-JIN LIN
  • Publication number: 20190081420
    Abstract: A stacked insertion structure for a flexible circuit board is provided. The flexible circuit board has an insertion section that is connected through a bent connection section to a fold-back section. The fold-back section is backward folded, through the bent connection section, toward and stacked on the insertion section such that a second coupling surface of the fold-back section corresponds to and overlap a first coupling surface of the insertion section for being insertable into an insertion socket of a connector. The fold-back section and the insertion section are bonded together with an adhesive layer therebetween or a height adjustment layer is provided therebetween to adjust an overall height of the two.
    Type: Application
    Filed: June 7, 2018
    Publication date: March 14, 2019
    Inventors: CHIH-HENG CHUO, KUO-FU SU, GWUN-JIN LIN
  • Patent number: 10159143
    Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. A resin-based conductive adhesive layer is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The resin-based conductive adhesive layer is pressed to bond between the conductive paste coating zone and a top insulation layer such that the conductive paste coating zone and the resin-based conductive adhesive layer achieve electrical connection therebetween.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: December 18, 2018
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Chih-Heng Chuo, Gwun-Jin Lin
  • Publication number: 20180270947
    Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
    Type: Application
    Filed: March 14, 2018
    Publication date: September 20, 2018
    Inventors: KUO-FU SU, CHIH-HENG CHUO, GWUN-JIN LIN
  • Patent number: 10080277
    Abstract: A signal attenuation reduction structure for a flexible circuit board includes at least one conductive paste coating zone formed on surfaces of signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to at least one signal line or covers a plurality of signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: September 18, 2018
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Chih-Heng Chuo, Gwun-Jin Lin
  • Patent number: 9942984
    Abstract: A signal attenuation reduction structure for a flexible circuit board includes a conductive paste coating zones formed on surfaces of high-frequency signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to a pair of high-frequency signal lines or covers a plurality of pairs of the high-frequency signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: April 10, 2018
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Chih-Heng Chuo, Gwun-Jin Lin
  • Patent number: 9913369
    Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: March 6, 2018
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Chih-Heng Chuo, Kuo-Fu Su, Gwun-Jin Lin
  • Publication number: 20170325331
    Abstract: A circuit board structure with selectively corresponding ground layers includes a first ground layer, a second ground layer, and a dielectric layer arranged between the first ground layer and the second ground layer to define a ground layer height difference between the first ground layer and the second ground layer. The first ground layer includes a plurality of non-electromagnetic shield areas. The circuit board includes a plurality of conductor wires formed thereon and selectively classified and divided into a first group of conductor wires and the second group of conductor wires. The first-group conductor wires are arranged to correspond to and electromagnetically couple to the first ground layer, and the second-group conductor wires are arranged to correspond to and electromagnetically couple to the second ground layer through the non-electromagnetic shield areas respectively, so that impedance value control is achieved.
    Type: Application
    Filed: March 6, 2017
    Publication date: November 9, 2017
    Inventors: CHIH-HENG CHUO, KUO-FU SU, GWUN-JIN LIN
  • Patent number: 9775249
    Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: September 26, 2017
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Gwun-Jin Lin
  • Patent number: 9578747
    Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: February 21, 2017
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Gwun-Jin Lin
  • Patent number: 9577304
    Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: February 21, 2017
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Chih-Heng Chuo, Gwun-Jin Lin, Kuo-Fu Su
  • Publication number: 20160360611
    Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.
    Type: Application
    Filed: August 18, 2016
    Publication date: December 8, 2016
    Inventors: KUO-FU SU, GWUN-JIN LIN
  • Patent number: 9468099
    Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: October 11, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Gwun-Jin Lin
  • Patent number: 9468101
    Abstract: Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: October 11, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Gwun-Jin Lin
  • Patent number: 9462679
    Abstract: An attenuation reduction grounding pattern structure for connection pads of a flexible circuit board includes a plurality of high frequency connection pads formed on a component surface of a substrate and a plurality of differential mode signal lines arranged on the substrate and connected to the high frequency connection pads. The substrate has a grounding surface forming a grounding layer. The grounding layer includes an attenuation reduction grounding pattern structure formed at a location corresponding to the transition zone and including a hollowed area and a protruded portion. The protruded portion extends a predetermined length in a direction from the grounding layer toward the high frequency connection pads and along the adjacent high frequency connection pads to reach the transition zone. The protruded portion and the high frequency connection pads form a polarization-direction-varying electric field in the transition zone.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: October 4, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Ching-Cheng Tien, Gwun-Jin Lin, Chih-Heng Chuo, Kuo-Fu Su
  • Patent number: 9462685
    Abstract: Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: October 4, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Gwun-Jin Lin, Kuo-Fu Su, Chih-Heng Chuo
  • Patent number: 9433086
    Abstract: Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof.
    Type: Grant
    Filed: May 21, 2014
    Date of Patent: August 30, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Chih-Heng Chuo, Gwun-Jin Lin
  • Publication number: 20160234937
    Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.
    Type: Application
    Filed: June 5, 2015
    Publication date: August 11, 2016
    Inventors: KUO-FU SU, GWUN-JIN LIN
  • Patent number: 9398692
    Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: July 19, 2016
    Assignee: Advanced Flexible Circuits Co., Ltd.
    Inventors: Kuo-Fu Su, Gwun-Jin Lin