Abstract: There is described an electroplating method and device for accomplishing the same whereby metal plating is disposed on a wire as said wire moves along an established path through the device. Relatively high speed deposition is achieved as a result of intermittent positioning of the device's inlet and outlet ports within the electrically conductive means of the device. The wire to be plated is established at a negative electrical potential and moved through said electrically conductive means. Accordingly, the conductive means is adapted for providing the electrolyte therein with a positive electrical potential to thereby provide the desired deposition.