Abstract: An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.

Abstract: A device with touch sensing includes a bracket, a pad disposed above one side of the bracket, the pad having a capacitance that varies as a touch is applied proximate to the device, and a sensing coil disposed below another side of the bracket that opposes the one side, with at least a portion of the sensing coil overlapping the pad.

Abstract: A touch sensing device includes: a force sensing unit including a sensing coil; and a metal portion. At least a portion of the metal portion is in contact with the force sensing unit, and the touch sensing device is configured such that a region of the metal portion overlapping with the sensing coil changes in response to a touch being applied to the touch sensing device.

Abstract: A force sensing device includes: a sensor support portion; at least one force sensor disposed on a first surface side of the sensor support portion; a frame disposed on a second surface side of the sensor support portion and spaced apart from the sensor support portion; and a pressure applying member disposed between the sensor support portion and the frame, and configured to apply pressure to the sensor support portion.

Abstract: A touch sensing device includes: a substrate; a first sensor disposed on the substrate; a second sensor disposed on the substrate; and a sensing circuit electrically connected to the first sensor and the second sensor. The sensing circuit is configured to compare signals sensed by the first sensor and the second sensor in accordance with an applied touch input and determine whether the applied touch input is normal.

Abstract: A method of generating an operating signal of an electronic device includes: deriving a force measurement value based on a change in inductance of a touch sensing device disposed inside a housing of the electronic device and configured to change inductance by external pressure applied to a touch switching unit of the housing; accumulatively recording the force measurement value derived in the deriving of the force measurement value; setting a reference value based on the recorded force measurement value, in response to the force measurement value being accumulatively recorded until a unit condition is satisfied; and generating an operating signal based on a high and low relationship between the force measurement value derived from the change in inductance occurring after the setting of the reference value, and the set reference value.

Abstract: A touch sensing device includes: a first sensing coil having conductivity; a second sensing coil having conductivity; a substrate having a space accommodating either one or both of the first sensing coil and the second sensing coil, wherein at least a portion of the substrate is disposed between the first sensing coil and the second sensing coil; and an elastic member configured to be compressed as external pressure is applied and the substrate descends.

Abstract: A touch sensing device includes: at least one sensing coil disposed on a substrate; a sensing circuit unit configured to detect applied external pressure, based on a change in inductance of the at least one sensing coil; and a deformation inducing shaft configured to block one side of the at least one sensing coil in one direction and open another side of the at least one sensing coil in another direction.

Abstract: A method of generating an operating signal of an electronic device includes: deriving a force measurement value based on a change in inductance of a touch sensing device disposed inside a housing of the electronic device and configured to change inductance by external pressure applied to a touch switching unit of the housing; accumulatively recording the force measurement value derived in the deriving of the force measurement value; setting a reference value based on the recorded force measurement value, in response to the force measurement value being accumulatively recorded until a unit condition is satisfied; and generating an operating signal based on a high and low relationship between the force measurement value derived from the change in inductance occurring after the setting of the reference value, and the set reference value.

Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

Abstract: A force sensing device includes: a sensor support portion; at least one force sensor disposed on a first surface side of the sensor support portion; a frame disposed on a second surface side of the sensor support portion and spaced apart from the sensor support portion; and a pressure applying member disposed between the sensor support portion and the frame, and configured to apply pressure to the sensor support portion.

Abstract: A touch sensing module is provided. The touch sensing module includes a flexible substrate including a coil portion including a plurality of layers and one or more coil patterns formed in at least one layer of the plurality of layers, and an extension portion that extends from the coil portion, and a sensing circuit, electrically connected to the coil pattern. The extension portion is configured to have a form in which at least one of the plurality of layers is extended.

Abstract: An electronic device includes a force-sensing apparatus. The force-sensing apparatus includes a planar-shaped frame, a force sensor, and a displacement portion. The force sensor is disposed on one surface of the frame. The displacement portion has a planar profile and one side coupled at an acute angle to the frame and another side freely disposed above a sensing surface of the force sensor.

Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

Abstract: An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

Abstract: An electronic component module includes a first substrate mounted on an upper surface of a second substrate such that at least a portion of a lower surface of the first substrate is exposed externally of the second substrate and electronic devices mounted on the first substrate and the second substrate, including at least one electronic device mounted on the upper surface of the second substrate.

Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

Abstract: Disclosed herein is a radio communication module, including: a printed circuit board provided with a receiving unit receiving a radio wave and provided with a via hole; an antenna including a connector which has a transmitting unit connected to the receiving unit formed thereat and forms a ring part outwardly bent at a tip thereof and forms a cut part at a circumference thereof so that the ring part is elastically deformed so as to be inserted and fastened into the via hole; a ground GND formed on the printed circuit board; and a discharge unit disposed between the receiving unit and the ground and including an ESD diode and a discharge line guiding electrostatic discharge (ESD) introduced from the outside to the ground.

Abstract: A wireless charging device may include: a sensor unit sensing an input from an external device and generating a wake-up signal; a control unit, upon receiving the wake-up signal, exiting from a sleep mode to enter an active mode, and generating an activation signal; a detection unit receiving the activation signal from the control unit to detect a mobile terminal; and a power supply unit, in the case that the detection unit detects the mobile terminal, supplying power to the mobile terminal wirelessly.

Abstract: Disclosed herein is a radio communication module, including: a printed circuit board provided with a receiving unit receiving a radio wave and provided with a via hole; an antenna including a connector which has a transmitting unit connected to the receiving unit formed thereat and forms a ring part outwardly bent at a tip thereof and forms a cut part at a circumference thereof so that the ring part is elastically deformed so as to be inserted and fastened into the via hole; a ground GND formed on the printed circuit board; and a discharge unit disposed between the receiving unit and the ground and including an ESD diode and a discharge line guiding electrostatic discharge (ESD) introduced from the outside to the ground.