Patents by Inventor Gyeong Ho Yun

Gyeong Ho Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT DISSIPATION MATERIAL, COMPOSITION INCLUDING SAME, AND PREPARATION METHOD THEREFOR
    Publication number: 20240043732
    Abstract: A heat dissipation material is provided. In the heat dissipation material with a filler, comprising secondary particles in which primary particles are aggregated, the filler in a polymer resin matrix may form a thermal interface layer for conduction of thermal energy between a heat generation part and a heat absorption part.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 8, 2024
    Applicant: KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY
    Inventors: Seung Hyup Lee, Gyeong Ho Yun, Yun Jin Kim, Su Hyeon Cho, Min Ho Nam