Abstract: This patent is about “A New Test Socket Pin & Socket Design for Semiconductor Chip Test”. According to the present invention, there is huge improvement on pin movement with different types of shape and materials. It makes better and stable contact between chip and PCB pad thanks to pivot shaft and rectangle elastomers. So it finally improves reliability of testing. In addition, there is cost reduction effect as we use the pin twice. Once the first contact terminal(Left side of pin) is worn out, the pin can be rotated to its other contact terminal(Right side) and reuse the opposite terminal.