Abstract: The present invention relates to a polyamic acid composition and a method for preparing same. Polyimide using a polyamic acid composition according to the present invention has excellent dielectric breakdown voltage performance and corona discharge initiation voltage while maintaining heat resistance and mechanical strength, and a polyimide coating prepared using the polyamic acid composition according to the present invention has excellent voltage endurance characteristics.

Abstract: Provided is a polyimide varnish comprising: polyamic acid and nanosilica, wherein the nanosilica contains 5 to 23 wt % relative to the solid content of the polyamic acid, and the nanosilica has a moisture content of less than 0.5 wt %.

Abstract: The present invention relates to a polyamic acid composition and a method for preparing same. A polyimide using the polyamic acid composition according to the present invention has excellent dielectric breakdown voltage performance and corona discharge initiation voltage while maintaining heat resistance or mechanical strength, and a polyimide coating manufactured using the polyamic acid composition according to the present invention has excellent voltage endurance characteristics.

Abstract: Provided is polyimide varnish comprising: polyamic acid containing dianhydride monomer and diamine monomer as polymerized units; and nanosilica, wherein the nanosilica has an absolute value of zeta potential of 10.0 mV to 40.0 mV.

Abstract: Provided is polyimide varnish comprising: a polyamic acid solution containing diamine monomer and dianhydride monomer as polymerized units; a first additive containing boron nitride; a second additive containing nanosilica; and a dispersant.

Abstract: The present invention provides: a polyimide coating material, which has low dielectric properties and improved adhesion between a conductor and the coating material and flexibility of the coating material while simultaneously preventing dielectric breakdown and partial discharge; and a coated electric wire.

Abstract: The present invention relates to a polyamic acid composition for packaging electronic components and a method for packaging electronic components using the same, wherein the polyamic acid composition comprises a dianhydride main component having a benzophenone structure as a dianhydride-based monomer in a high proportion and a diamine component having a benzene ring as a diamine-based monomer, whereby it is possible to improve a coefficient of thermal expansion, a glass transition temperature, an elongation, and the like of a polyimide thin film formed therefrom, and when the polyimide thin film is used as a packaging material for an inorganic material such as a silicon water, it exhibits excellent adhesion to the inorganic material and can be easily removed upon O2 plasma removal, as well as has a remarkably low residual ratio of organic residues on the surface of the inorganic material after the removal, so that it can be easily used as a packaging material for electronic components and the like.

Abstract: The present invention relates to a polyamic acid composition for coating a conductor, and provides a polyamic acid composition for coating a conductor that prevents dielectric breakdown and partial discharge of a cured product while improving adhesion between a conductor and a coating material and flexibility of the coating material.

Abstract: The present application provides; a varnish, which is a polyimide precursor that is imidized by thermal curing, and implements the insulation, adhesion, heat resistance, mechanical strength, and light resistance of polyimide; a film including same; and a vehicle device coated with the film.

Abstract: The present application relates to a polyamic acid composition, a method for preparing the polyamic acid composition, and a polyimide comprising the same, which provides a polyamic acid composition capable of implementing a low permittivity, and heat resistance and mechanical properties simultaneously, a method for preparing the polyamic acid composition and a polyimide comprising the same.

Abstract: The present application relates to a polyamic acid composition, a method for preparing the polyamic acid composition, a polyimide comprising the same, and a coating material comprising the same, which provides a polyamic acid composition capable of implementing a low permittivity and heat resistance, and insulation properties and mechanical properties in a harsh condition such as a high temperature simultaneously, a method for preparing the polyamic acid composition, a polyimide comprising the same and a coating material comprising the same.

Abstract: The present application relates to a polyamic acid composition, a method for preparing the polyamic acid composition, a polyimide comprising the same, and a coating material comprising the same, which provides a polyamic acid composition capable of implementing a low permittivity and heat resistance, and insulation properties, adhesion and mechanical properties in a harsh condition such as a high temperature simultaneously, a method for preparing the polyamic acid composition, a polyimide comprising the same and a coating material comprising the same.

Abstract: The present application relates to a polyimide and a manufacturing method therefor, thereby providing a polyimide capable of implementing excellent adhesion force while maintaining the inherent characteristics of the polyimide, and a manufacturing method therefor.

Abstract: The present invention provides a polyamic acid composition, which, in a cured state on a substrate of amorphous or crystalline silicon, has an adhesion of 0.05-0.1 N/cm with the amorphous or crystalline silicon.

Abstract: The present invention relates to a polyamic acid composition for packaging electronic components and a method for packaging electronic components using the same, wherein the polyamic acid composition comprises a dianhydride main component having a benzophenone structure as a dianhydride-based monomer in a high proportion and a diamine component having a benzene ring as a diamine-based monomer, whereby it is possible to improve a coefficient of thermal expansion, a glass transition temperature, an elongation, and the like of a polyimide thin film formed therefrom, and when the polyimide thin film is used as a packaging material for an inorganic material such as a silicon water, it exhibits excellent adhesion to the inorganic material and can be easily removed upon O2 plasma removal, as well as has a remarkably low residual ratio of organic residues on the surface of the inorganic material after the removal, so that it can be easily used as a packaging material for electronic components and the like.

Abstract: The present invention relates to a polyamic acid composition for packaging electronic components and a method for packaging electronic components using the same, wherein the polyamic acid composition comprises a dianhydride main component having a benzophenone structure as a dianhydride-based monomer in a high proportion and a diamine component having a benzene ring as a diamine-based monomer, whereby it is possible to improve a coefficient of thermal expansion, a glass transition temperature, an elongation, and the like of a polyimide thin film formed therefrom, and when the polyimide thin film is used as a packaging material for an inorganic material such as a silicon water, it exhibits excellent adhesion to the inorganic material and can be easily removed upon 02 plasma removal, as well as has a remarkably low residual ratio of organic residues on the surface of the inorganic material after the removal, so that it can be easily used as a packaging material for electronic components and the like.