Patents by Inventor Gyeong-Tae KANG

Gyeong-Tae KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10610909
    Abstract: Disclosed is a washer idler roller and a wafer cleaner using the same in which the wafer cleaner prevents wafer slip and wafer hunting so that the wafer rotates stably, and it is possible to efficiently determine whether the wafer is clean or not by precise detection of a rotation state of the wafer. The wafer cleaner of semiconductor manufacturing equipment according to the present invention includes a wafer roller for rotating the wafer, an idler detecting a rotation speed of the wafer, and brushes respectively disposed at opposite sides of the wafer, wherein the idler includes a first body configured to rotate, a pair of first guide portions disposed at the first body, and a washer idler roller disposed between the first guide portions and being in contact with an outer circumferential surface of the wafer.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: April 7, 2020
    Inventors: Gyeong-Tae Kang, Yoon-Sik Kim
  • Publication number: 20180339319
    Abstract: Disclosed is a washer idler roller and a wafer cleaner using the same in which the wafer cleaner prevents wafer slip and wafer hunting so that the wafer rotates stably, and it is possible to efficiently determine whether the wafer is clean or not by precise detection of a rotation state of the wafer. The wafer cleaner of semiconductor manufacturing equipment according to the present invention includes a wafer roller for rotating the wafer, an idler detecting a rotation speed of the wafer, and brushes respectively disposed at opposite sides of the wafer, wherein the idler includes a first body configured to rotate, a pair of first guide portions disposed at the first body, and a washer idler roller disposed between the first guide portions and being in contact with an outer circumferential surface of the wafer.
    Type: Application
    Filed: October 25, 2017
    Publication date: November 29, 2018
    Inventors: Gyeong-Tae KANG, Yoon-Sik KIM