Abstract: A device for detecting a solution state includes: a probe including a detecting portion having at least one open surface to measure the solution state; a mesh disposed on a path through which a solution is introduced to the detecting portion; and a support portion disposed on the outside of the probe, and having an opening surrounding the at least one open surface of the detecting portion. The opening defines the path through which the solution is introduced to the detecting portion, and the mesh is mounted in the opening of the support portion.

Abstract: A semiconductor package includes: a first redistribution structure including a first insulating layer and first conductive patterns; a connection substrate on the first redistribution structure, and including a base layer and a through electrode penetrating the base layer, wherein the base layer includes a first material; a molding layer at least partially surrounding the connection substrate and disposed on the first redistribution structure, wherein the molding layer includes a second material; a second redistribution structure disposed on the molding layer and the connection substrate; and a plurality of semiconductor devices spaced apart from each other on the second redistribution structure, wherein a first thermal expansion coefficient of the first material of the base layer is less than a second thermal expansion coefficient of the second material of the molding layer, and wherein an upper surface of the base layer is substantially coplanar with an upper surface of the molding layer.

Abstract: A portable air purifier is provided that may include a fan module disposed between a suction opening and a discharge opening, a filter disposed between the suction opening and the fan module, and a lighting portion disposed between the discharge opening and the fan module.

Abstract: A semiconductor package may include: a first redistribution layer structure; a bridge structure on the first redistribution layer structure; a plurality of conductive pillars on the first redistribution layer structure and side by side with the bridge structure; an encapsulant molding the bridge structure and the plurality of conductive pillars on the first redistribution layer structure; a second redistribution layer structure on the encapsulant, wherein a region of the second redistribution layer structure on the bridge structure is defined as a first region and a region other than the first region is defined as a second region; and a plurality of bonding pads at the first region. A vertical thickness of the first region may be smaller than a vertical thickness of the second region.

Abstract: A fan-out semiconductor package includes a wiring substrate including a first fan-in region, a fan-out region surrounding the first fan-in region, and a second fan-in region, a first fan-in chip structure, a second fan-in chip structure, a first redistribution structure including first redistribution elements disposed on a bottom surface of the wiring substrate, and a second redistribution structure disposed on a top surface of the wiring substrate, and a chip wiring structure formed on a top surface of the second chip, and the second redistribution structure includes a second redistribution layer extending to the first fan-in region and the fan-out region, a plurality of second redistribution vias integrally formed with the second redistribution layer and extending downward, and a seed layer surrounding the second redistribution layer and bottom surfaces of the plurality of second redistribution vias.

Abstract: A portable air purifier is provided that may include a fan module disposed between a suction opening and a discharge opening, a filter disposed between the suction opening and the fan module, and a lighting portion disposed between the discharge opening and the fan module.

Abstract: The apparatus for manufacturing cosmetics comprises the contents absorption step using an absorbent including: (1) a transfer table for transferring a cosmetic container, (2) a suction portion for sucking foreign matter inside an accommodation space of the cosmetic container, (3) a contents injection portion for injecting contents into the accommodation space, (4) an absorbent supply portion for injecting an absorbent into the accommodation space, (5) an absorbent press portion for repeatedly pressing the absorbent inside the accommodation portion, (6) an edge member supply portion for injecting an edge member for fixing the absorbent inside the accommodation space, and (7) an absorbent fixing portion for allowing the edge member to be fixed inside the accommodation space.

Abstract: The apparatus for manufacturing cosmetics comprises the contents absorption step using an absorbent including: (1) a transfer table for transferring a cosmetic container, (2) a suction portion for sucking foreign matter inside an accommodation space of the cosmetic container, (3) a contents injection portion for injecting contents into the accommodation space, (4) an absorbent supply portion for injecting an absorbent into the accommodation space, (5) an absorbent press portion for repeatedly pressing the absorbent inside the accommodation portion, (6) an edge member supply portion for injecting an edge member for fixing the absorbent inside the accommodation space, and (7) an absorbent fixing portion for allowing the edge member to be fixed inside the accommodation space.