Abstract: A condensing device for a sputtering device capable of condensing metal atoms to be ejected from a metal target onto a semiconductor substrate in a scattered manner and thereby easily depositing the metal atoms on side walls of contact holes formed at the semiconductor substrate is disclosed. The condensing device includes a plurality of condensing tubes arranged in the form of a bundle and adapted to condense the metal atoms ejected from the metal target, each of the condensing tubes being constituted by a set of condensing plates, and a plurality of inclination adjusting plates each interposed between adjacent ones of the condensing tubes and adapted to incline each of the adjacent condensing tubes at an angle ranging between 0.degree. to 15.degree..