Abstract: A method of manufacturing an electromagnetic wave shielding material using a perforated metal thin plate, the method including: forming a gel coat to a mold; forming a first metal layer on a first composite layer by arranging a perforated metal thin plate, after forming the first composite layer on the gel coat layer formed in the first step; forming a second metal layer by arranging a perforated metal thin plate and the first metal layer formed in the second step in such a way that positions of perforations are arranged in a staggered manner without overlapping, after forming a second composite layer on the first metal layer formed in the second step; and molding the electromagnetic wave shielding material by curing and demolding after forming a third composite material on the second metal layer formed in the third step.

Abstract: A method of manufacturing an electromagnetic wave shielding material using a perforated metal thin plate, the method including: forming a gel coat to a mold; forming a first metal layer on a first composite layer by arranging a perforated metal thin plate, after forming the first composite layer on the gel coat layer formed in the first step; forming a second metal layer by arranging a perforated metal thin plate and the first metal layer formed in the second step in such a way that positions of perforations are arranged in a staggered manner without overlapping, after forming a second composite layer on the first metal layer formed in the second step; and molding the electromagnetic wave shielding material by curing and demolding after forming a third composite material on the second metal layer formed in the third step.

Abstract: The present invention relates to: a method for plating nonwoven fabric with metals (copper and nickel, or nickel and nickel) by electroless and electrolytic continuous processes; and a nonwoven fabric plated by the method. The present invention can prepare a metal-plated nonwoven fabric by electrolytic plating a space of metal ions, which are formed by performing electroless plating with copper or nickel, with nickel in a short amount of time, thereby filling up the space, and thus has excellent conductivity while being thin. A desired conductivity can be obtained by changing the composition of a plating solution or controlling the plating velocity, and a line capable of performing plating with copper and nickel, nickel and nickel, nickel alone, or copper alone, in combination, can be manufactured. In addition, a highly conductive nonwoven fabric having no difference in plating thickness of nonwoven fabric performed by only electroless plating can be produced.