Patents by Inventor Gyuhyeong KIM

Gyuhyeong KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250046663
    Abstract: A semiconductor package includes a package substrate having a first region, a second region and third region sequentially arranged from a first side portion to a second side portion thereof. The second region has a chip mounting region in a central region. A semiconductor chip is disposed in the chip mounting region and is mounted on a plurality of substrate pads of the package substrate. A pair of first flow control structures is disposed in the first region and is arranged symmetrically on both sides along a center line passing through a center of the chip mounting region. At least one pair of second flow control structures is disposed in the second region of the package substrate and is arranged symmetrically on both sides of the chip mounting region. A molding member is on the package substrate and fills a gap between the semiconductor chip and the package substrate.
    Type: Application
    Filed: May 17, 2024
    Publication date: February 6, 2025
    Inventors: Taejun JEON, Yongkwan LEE, Seunghwan KIM, Junwoo PARK, Gyuhyeong KIM
  • Publication number: 20240420972
    Abstract: Disclosed are semiconductor molding apparatuses and compression molding methods. The semiconductor molding apparatus comprises an upper mold capable of supporting a substrate, a lower mold that provides a first cavity capable of being filled with a resin, a guide member that provides a second cavity to be filled with the resin and vertically penetrates the lower mold, and a guide lift capable of driving the guide member to vertically move. The lower mold includes a base plate that extends in a horizontal direction and a sidewall member that upwardly extends from the base plate. The guide lift drives the guide member to vertically move such that a top surface of the guide member moves between a top surface of the base plate and a top surface of the sidewall member.
    Type: Application
    Filed: January 2, 2024
    Publication date: December 19, 2024
    Inventors: Taejun JEON, Yongkwan LEE, Gyuhyeong KIM, Seung Hwan KIM, Jongwan KIM, Junwoo PARK
  • Publication number: 20240360168
    Abstract: An organometallic compound represented by Chemical Formula 1, Ir(LA)m(LB)n, and an organic light-emitting diode including the same. The organometallic compound may act as a dopant of a light-emitting layer of the organic light-emitting diode. An operation voltage of the device may be lowered, and luminous efficiency and a lifespan thereof may be improved.
    Type: Application
    Filed: April 25, 2024
    Publication date: October 31, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: Kusun Choung, Hansol Park, Nayeon Lee, Gyuhyeong Kim, Soonjae Hwang
  • Publication number: 20240128190
    Abstract: A semiconductor package includes a lower substrate including a lower interconnection layer; an upper substrate on the lower substrate, a recessed surface having a step difference, and an upper interconnection layer having a through-hole extending from the recessed surface to the first surface of the upper substrate and electrically connected to the lower interconnection layer; semiconductor chip between the recessed surface of the upper substrate and the lower substrate and including connection pads electrically connected to the lower interconnection layer; interconnect structure between the second surface of the upper substrate and the lower substrate and electrically connecting the lower interconnection layer to the upper interconnection layer; and an insulating member including a first portion covering at least a portion of the semiconductor chip and interconnect structure, a second portion extending from the first portion into the through-hole, and a third portion covering at least a portion of the first
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: Seunghwan Kim, Yongkwan Lee, Gyuhyeong Kim, Jungjoo Kim, Jongwan Kim, Junwoo Park, Taejun Jeon, Junhyeung Jo
  • Publication number: 20240096748
    Abstract: A chip protection device includes a protection frame extending around side surfaces of a semiconductor chip mounted on a substrate. The protection frame includes a plurality of side walls, each wall facing and spaced apart from a respective side surface of the semiconductor chip, and a plurality of upper walls, each upper wall extending inward from an upper portion of a respective side wall toward the semiconductor chip. A plurality of apertures are formed through the side walls and through which a fluid enters and exits. The protection frame defines an inner space in which the fluid can flow via the plurality of apertures. Heat from the side surfaces of the semiconductor chip is transferred to the fluid in the inner space.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 21, 2024
    Inventors: Taejun JEON, Yongkwan LEE, Gyuhyeong KIM, Seunghwan KIM, Jongwan KIM, Junwoo PARK
  • Publication number: 20230209987
    Abstract: An organic light emitting diode includes an anode, an emission layer disposed on the anode and including a host, a phosphorescent dopant represented by Chemical Formula 1 and a fluorescent dopant represented by Chemical Formula 2, and a cathode disposed on the emission layer formed by mixing the fluorescent dopant with the phosphorescent dopant bonded to an acceptor at a specific site, thereby energy loss during an emission process can be minimized and energy transfer efficiency can be improved, and an organic light emitting diode with improved luminous efficiency and an organic light emitting display device having the same can be provided.
    Type: Application
    Filed: October 28, 2022
    Publication date: June 29, 2023
    Applicant: LG DISPLAY CO., LTD.
    Inventors: TaeRyang HONG, Gyuhyeong KIM
  • Publication number: 20230209854
    Abstract: An organic light emitting diode includes an anode, an emission layer disposed on the anode and including a host, a phosphorescent dopant represented by Chemical Formula 1 and a fluorescent dopant represented by Chemical Formula 2, and a cathode disposed on the emission layer formed by mixing the fluorescent dopant with the phosphorescent dopant including an acceptor at a specific site, thereby energy loss during an emission process can be minimized and energy transfer efficiency can be improved and an organic light emitting diode with excellent luminous efficiency and an organic light emitting display device having the same can be achieved.
    Type: Application
    Filed: October 28, 2022
    Publication date: June 29, 2023
    Applicant: LG DISPLAY CO., LTD.
    Inventors: TaeRyang HONG, Gyuhyeong KIM
  • Publication number: 20230203075
    Abstract: Disclosed is a novel organometallic compound in which a main ligand (LA) has a fused ring structure including a thiophene group. The organometallic compound acts as a dopant of a phosphorescent light-emitting layer of an organic light-emitting diode. Thus, an operation voltage of the diode is lowered, and luminous efficiency and a lifespan thereof are improved.
    Type: Application
    Filed: December 23, 2022
    Publication date: June 29, 2023
    Applicants: LG DISPLAY CO., LTD., ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
    Inventors: Kusun CHOUNG, Gyuhyeong KIM, Yoojeong JEONG, Hansol PARK, Kyoung-Jin PARK, Hyun KIM, Jin Ri HONG, Yeon Gun LEE