Patents by Inventor Gyujei LEE

Gyujei LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and stack-type semiconductor package having the same
    Patent number: 9087819
    Abstract: A semiconductor package includes a semiconductor chip having a first surface, a second surface which faces away from the first surface, and through holes which pass through the first surface and the second surface; a dielectric layer formed on one or more of the first surface and the second surface and formed with grooves around the through holes on a fourth surface of the dielectric layer facing away from a third surface of the dielectric layer which is attached to the semiconductor chip; through-silicon vias filling the through holes; and bumps formed on the through-silicon vias and on portions of the dielectric layer around the through-silicon vias and filling the grooves.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: July 21, 2015
    Assignee: SK Hynix Inc.
    Inventors: Gyujei Lee, Kang Won Lee
  • SEMICONDUCTOR PACKAGE AND STACK-TYPE SEMICONDUCTOR PACKAGE HAVING THE SAME
    Publication number: 20130037939
    Abstract: A semiconductor package includes a semiconductor chip having a first surface, a second surface which faces away from the first surface, and through holes which pass through the first surface and the second surface; a dielectric layer formed on one or more of the first surface and the second surface and formed with grooves around the through holes on a fourth surface of the dielectric layer facing away from a third surface of the dielectric layer which is attached to the semiconductor chip; through-silicon vias filling the through holes; and bumps formed on the through-silicon vias and on portions of the dielectric layer around the through-silicon vias and filling the grooves.
    Type: Application
    Filed: December 22, 2011
    Publication date: February 14, 2013
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Gyujei LEE, Kang Won LEE
  • CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME
    Publication number: 20120127660
    Abstract: Cylindrical packages are provided. The cylindrical package includes a cylindrical substrate having a hollow region therein and at least one semiconductor chip mounted on an outer circumference of the cylindrical substrate. Related electronic products and related fabrication methods are also provided.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 24, 2012
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Kang Won LEE, Hyun Joo KIM, Gyujei LEE