Patents by Inventor Gyu-Mook KIM
Gyu-Mook KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132021Abstract: An apparatus for controlling a discharge pressure of a fluid includes: a pump configured to suck the fluid through an inlet or to discharge the sucked fluid through an outlet; a distributor connected to the pump and to an injection nozzle provided by a sensor and configured to distribute the fluid discharged from the pump to the sensor; and a controller. The controller is configured to control the pump to operate selectively in accordance with detection of contamination of the sensor and to control operation of the distributor to be forcibly delayed during operation of the pump such that the fluid distributed to the sensor, when detected as being contaminated, is controlled to reach a selected required discharge pressure of different required discharge pressures selected in accordance with water amount information and a degree of contamination of the sensor.Type: ApplicationFiled: April 30, 2023Publication date: April 25, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DY AUTO CORPORATIONInventors: Young Joon Shin, Chan Mook Choi, Gyu Won Han, Jong Min Park, Jin Hee Lee, Jong Wook Lee, Min Wook Park, Seong Jun Kim, Hyeong Jun Kim, Sun Ju Kim
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Publication number: 20230245989Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.Type: ApplicationFiled: April 7, 2023Publication date: August 3, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
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Publication number: 20230199956Abstract: A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.Type: ApplicationFiled: May 10, 2022Publication date: June 22, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
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Publication number: 20230171888Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.Type: ApplicationFiled: September 1, 2022Publication date: June 1, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon KIM, Young Kuk KO, Gyu Mook KIM, Hea Sung KIM, Chi Won HWANG, Suk Chang HONG
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Publication number: 20230147912Abstract: A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.Type: ApplicationFiled: March 10, 2022Publication date: May 11, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
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Publication number: 20220320027Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.Type: ApplicationFiled: February 28, 2022Publication date: October 6, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
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Patent number: 11297714Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.Type: GrantFiled: October 14, 2020Date of Patent: April 5, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Kuk Ko, Yoong Oh, Sang-Hoon Kim, Gyu-Mook Kim, Yong-Soon Jang, Hea-Sung Kim
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Patent number: 10991647Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.Type: GrantFiled: October 21, 2019Date of Patent: April 27, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yoong Oh, Sang-Hoon Kim, Hea-Sung Kim, Gyu-Mook Kim, Young-Kuk Ko
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Publication number: 20210029825Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.Type: ApplicationFiled: October 14, 2020Publication date: January 28, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Kuk KO, Yoong OH, Sang-Hoon KIM, Gyu-Mook KIM, Yong-Soon JANG, Hea-Sung KIM
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Patent number: 10849225Abstract: A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.Type: GrantFiled: January 6, 2020Date of Patent: November 24, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Kuk Ko, Yoong Oh, Sang-Hoon Kim, Gyu-Mook Kim, Yong-Soon Jang, Hea-Sung Kim
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Publication number: 20200260580Abstract: A printed circuit board includes: an insulating layer; a via passing through the insulating layer; and a metal post in contact with a surface of the via, and protruding from the insulating layer. The metal post includes a region having a width that is greater than a width of the via.Type: ApplicationFiled: October 24, 2019Publication date: August 13, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Kuk KO, Yoong OH, Sang-Hoon KIM, Gyu-Mook KIM, Hea-Sung KIM
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Publication number: 20200152566Abstract: A printed circuit board including: an insulating material having a bump pad embedded in a first surface thereof; a first insulating layer stacked on the first surface of the insulating material and including an opening portion exposing the bump pad; a second insulating layer stacked on the first insulating layer and including a first cavity exposing the opening portion; and a bump disposed on the bump pad in the opening portion.Type: ApplicationFiled: October 21, 2019Publication date: May 14, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Yoong OH, Sang-Hoon KIM, Hea-Sung KIM, Gyu-Mook KIM, Young-Kuk KO