Abstract: A cooling unit in a photolithography equipment may comprise a spin chuck module including a spin chuck configured to suction and fix a wafer. The cooling unit may also include a spin motor configured to rotate the spin chuck, the spin motor being located below the spin chuck. The cooling unit may also include a thinner spray module configured to cool the wafer to a predetermined temperature by spraying a thinner onto the wafer. The cooling unit may also include a cooling control module configured to control the cooling of the wafer.

Abstract: A photoresist suck-back device is shown for a photoresist supply apparatus in a semiconductor device manufacturing system which prevents the accumulation of photoresist inside a photoresist spray line. The suck-back device is composed of a suck-back valve which is installed on a photoresist spray line connected to a photoresist supply line of a photoresist supply apparatus. The suck-back valve is constructed of a suction chamber for sucking the photoresist remaining within the photoresist spray line. The suction chamber is shrinkable and has a shape such that the sucked photoresist is not accumulated therein. A control part controls the size of the suction chamber of the suck-back valve through an air line. A cut-off valve is disposed between the photoresist supply line and the photoresist spray line which opens and closes the photoresist supply line under control of the control part through the air line.

Abstract: A photoresist spraying apparatus for coating a photoresist with pressure from a nitrogen gas includes a tank which has a photoresist holding portion and an air portion. A photoresist inflow conduit is connected to a sidewall of the tank to intake photoresist and a photoresist outflow conduit is connected to a bottom of the tank for discharging photoresist. A T-shaped gas conduit has a gas inlet, a gas outlet and a connecting portion therebetween for connecting to the tank. The flow of a gas from the gas inlet to the gas outlet lowers the air pressure inside the tank so that air and bubbles remaining inside the tank are discharged to the gas outlet via the connecting portion, while a photoresist flows into the tank via the photoresist inflow conduit. A valve, provided in the gas outlet of the gas conduit, opens and closes to fill and discharge photoresist in the tank according to the pressure inside the tank.

Abstract: An apparatus for removing a photoresist from the edge of a semiconductor wafer includes a nozzle for finely spraying a liquid for removing a photoresist. The horizontal position of the nozzle is controlled by a horizontal fixture having a screw groove formed therein. A guide rail has a channel into which the horizontal fixture is slidably inserted. A scale marked on a peripheral surface of the guide rail verifies the position of a reference mark on the horizontal fixture. A fine adjustment screw is inserted into the screw groove of the horizontal fixture to a variable depth for adjusting the horizontal position of the horizontal fixture. A shaft is connected to the guide rail, with the shaft having a top portion functioning as a piston, for adjusting the vertical position of the nozzle by fixing the guide rail to the shaft and moving the resulting combination up and down. The top portion of the shaft is movable within a cylinder.