Patents by Inventor Gyu-Seok Kim

Gyu-Seok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150253909
    Abstract: Embodiments of the invention provide a touch sensor including a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern is formed by continuously connecting one or more unit patterns, and each unit pattern has closed figures formed to be irregularly arranged therein.
    Type: Application
    Filed: July 25, 2014
    Publication date: September 10, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyu Seok KIM, Hee Suk CHUNG, Dong Yong KIM, Dek Gin YANG, Mi Yang KIM, Tae Young KIM
  • Patent number: 9099329
    Abstract: There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: August 4, 2015
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Suk Chung, Gyu Seok Kim, Han Wool Kang, Kyung Ho Lee, Mi Yang Kim, Suk Jin Ham
  • Patent number: 9095063
    Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.
    Type: Grant
    Filed: February 17, 2014
    Date of Patent: July 28, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Eun Ju Yang, Gyu Seok Kim, Suk Jin Ham, Se Yoon Park, Jin Uk Cha, Hee Suk Chung, Mi Yang Kim
  • Publication number: 20150136458
    Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.
    Type: Application
    Filed: February 17, 2014
    Publication date: May 21, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Eun Ju Yang, Gyu Seok Kim, Suk Jin Ham, Se Yoon Park, Jin Uk Cha, Hee Suk Chung, Mi Yang Kim
  • Publication number: 20150114131
    Abstract: Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested.
    Type: Application
    Filed: February 24, 2014
    Publication date: April 30, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Cha, Gyu Seok Kim, Eun Ju Yang, Mi Yang Kim, Suk Jin Ham
  • Publication number: 20140174193
    Abstract: There are provided a method, an apparatus and a sample for evaluating bonding strength, the method including setting a micro-region including a bonded interface in an evaculated sample, forming a first groove in a circumferential portion of the micro-region to have a predetermined depth, processing a side of the micro-region to form a second groove connected to the bonded interface, and applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated.
    Type: Application
    Filed: February 21, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyu Seok KIM, Hee Suk CHUNG, Hyun Jung LEE, Suk-Jin HAM, Ju Wan NAM, Jin Uk CHA, Mi Yang KIM
  • Publication number: 20140152980
    Abstract: There are provided an inspection device for substrate deformation at high temperatures and an inspection method for substrate deformation at high temperatures, the inspection device for substrate deformation at high temperatures, including a crucible including an internal space, an inspection hole disposed in an upper portion thereof so as to inspect the internal space, and a heating unit heating the internal space, an indenter tip disposed in the crucible such that a substrate fixed to the internal space is warped, and an inspection unit disposed above the crucible so as to inspect a cross-section of the substrate.
    Type: Application
    Filed: February 21, 2013
    Publication date: June 5, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyu Seok KIM, Hee Suk CHUNG, Suk Jin HAM, Dong Yong KIM, Yong Choon PARK, Mi Yang KIM, Tae Yoon KIM
  • Publication number: 20140138611
    Abstract: There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.
    Type: Application
    Filed: March 1, 2013
    Publication date: May 22, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Suk CHUNG, Gyu Seok KIM, Han Wool KANG, Kyung Ho LEE, Mi Yang KIM, Suk Jin HAM
  • Patent number: 5701126
    Abstract: A variable length code decoding apparatus stores a 2.sup.n -bit variable length coded serial input bit stream, n being a positive integer, and, in response to a control signal, outputs in parallel an objective bit stream having a predetermined number of bits and decodes the objective bit stream from the interface means and outputting a decoded symbol together with its codeword length data. A variable length code decoding apparatus compares the codeword in the objective bit stream and the decoded symbol with the variable length data in the table and generates the control signal.
    Type: Grant
    Filed: November 17, 1995
    Date of Patent: December 23, 1997
    Assignee: Daewoo Electronics, Co., Ltd.
    Inventor: Gyu-Seok Kim
  • Patent number: 5648775
    Abstract: A variable length code decoding apparatus for decoding sequential variable length codewords includes a bit shifting circuit for providing a window output sequence of the two fixed length segments stored in latch circuits, a bit generation circuit for generating an N-bit output sequence by using the window output sequence as low-order bits of the N-bit output sequence, a decoding sequence generation circuit for producing a decoding output sequence of the two fixed length segments in response to the codeword length signal, a table memory device for producing fixed length codewords in response to a variable length codeword that begins at the first bit position of the decoding output sequence and for producing codeword lengths corresponding to the decoded variable length codewords, an output selection circuit for selecting an output codeword and a codeword length among the produced fixed length codewords and codeword lengths corresponding to the decoded variable length codewords, in response to an output selectio
    Type: Grant
    Filed: November 17, 1995
    Date of Patent: July 15, 1997
    Assignee: Daewoo Electronics Co., Ltd.
    Inventor: Gyu-Seok Kim
  • Patent number: 5394144
    Abstract: A variable length code (VLC) decoding apparatus disclosed herein has an interface circuit 10 wherein an input bit stream is fed. The interface circuit 10 includes a plurality of window registers for directly extracting the decoding objective bit stream from the input bit stream. Each of the window registers has 2.sup.n -bit storage locations for storing an bit stream shifted by 1 bit from that of its adjacent window registers. Therefore, the VLC decoding apparatus advantageously achieves a high speed for decoding operation through the use of a plurality of window registers for directly extracting a next undecoded sequence of an input bit stream.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: February 28, 1995
    Assignee: Daewoo Electronics Co., Ltd.
    Inventor: Gyu-Seok Kim