Patents by Inventor Gyu-Seok Kim
Gyu-Seok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150253909Abstract: Embodiments of the invention provide a touch sensor including a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern is formed by continuously connecting one or more unit patterns, and each unit pattern has closed figures formed to be irregularly arranged therein.Type: ApplicationFiled: July 25, 2014Publication date: September 10, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyu Seok KIM, Hee Suk CHUNG, Dong Yong KIM, Dek Gin YANG, Mi Yang KIM, Tae Young KIM
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Patent number: 9099329Abstract: There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.Type: GrantFiled: March 1, 2013Date of Patent: August 4, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hee Suk Chung, Gyu Seok Kim, Han Wool Kang, Kyung Ho Lee, Mi Yang Kim, Suk Jin Ham
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Patent number: 9095063Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.Type: GrantFiled: February 17, 2014Date of Patent: July 28, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Eun Ju Yang, Gyu Seok Kim, Suk Jin Ham, Se Yoon Park, Jin Uk Cha, Hee Suk Chung, Mi Yang Kim
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Publication number: 20150136458Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.Type: ApplicationFiled: February 17, 2014Publication date: May 21, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eun Ju Yang, Gyu Seok Kim, Suk Jin Ham, Se Yoon Park, Jin Uk Cha, Hee Suk Chung, Mi Yang Kim
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Publication number: 20150114131Abstract: Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested.Type: ApplicationFiled: February 24, 2014Publication date: April 30, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Cha, Gyu Seok Kim, Eun Ju Yang, Mi Yang Kim, Suk Jin Ham
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Publication number: 20140174193Abstract: There are provided a method, an apparatus and a sample for evaluating bonding strength, the method including setting a micro-region including a bonded interface in an evaculated sample, forming a first groove in a circumferential portion of the micro-region to have a predetermined depth, processing a side of the micro-region to form a second groove connected to the bonded interface, and applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated.Type: ApplicationFiled: February 21, 2013Publication date: June 26, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyu Seok KIM, Hee Suk CHUNG, Hyun Jung LEE, Suk-Jin HAM, Ju Wan NAM, Jin Uk CHA, Mi Yang KIM
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Publication number: 20140152980Abstract: There are provided an inspection device for substrate deformation at high temperatures and an inspection method for substrate deformation at high temperatures, the inspection device for substrate deformation at high temperatures, including a crucible including an internal space, an inspection hole disposed in an upper portion thereof so as to inspect the internal space, and a heating unit heating the internal space, an indenter tip disposed in the crucible such that a substrate fixed to the internal space is warped, and an inspection unit disposed above the crucible so as to inspect a cross-section of the substrate.Type: ApplicationFiled: February 21, 2013Publication date: June 5, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyu Seok KIM, Hee Suk CHUNG, Suk Jin HAM, Dong Yong KIM, Yong Choon PARK, Mi Yang KIM, Tae Yoon KIM
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Publication number: 20140138611Abstract: There is provided an In nanowire including a substrate, an indium thin film formed on the substrate, an insulating film formed on the indium thin film and having at least one through hole through formation of a pattern, and an In nanowire vertically protruded from the indium thin film through the at least one through hole.Type: ApplicationFiled: March 1, 2013Publication date: May 22, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hee Suk CHUNG, Gyu Seok KIM, Han Wool KANG, Kyung Ho LEE, Mi Yang KIM, Suk Jin HAM
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Patent number: 5701126Abstract: A variable length code decoding apparatus stores a 2.sup.n -bit variable length coded serial input bit stream, n being a positive integer, and, in response to a control signal, outputs in parallel an objective bit stream having a predetermined number of bits and decodes the objective bit stream from the interface means and outputting a decoded symbol together with its codeword length data. A variable length code decoding apparatus compares the codeword in the objective bit stream and the decoded symbol with the variable length data in the table and generates the control signal.Type: GrantFiled: November 17, 1995Date of Patent: December 23, 1997Assignee: Daewoo Electronics, Co., Ltd.Inventor: Gyu-Seok Kim
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Patent number: 5648775Abstract: A variable length code decoding apparatus for decoding sequential variable length codewords includes a bit shifting circuit for providing a window output sequence of the two fixed length segments stored in latch circuits, a bit generation circuit for generating an N-bit output sequence by using the window output sequence as low-order bits of the N-bit output sequence, a decoding sequence generation circuit for producing a decoding output sequence of the two fixed length segments in response to the codeword length signal, a table memory device for producing fixed length codewords in response to a variable length codeword that begins at the first bit position of the decoding output sequence and for producing codeword lengths corresponding to the decoded variable length codewords, an output selection circuit for selecting an output codeword and a codeword length among the produced fixed length codewords and codeword lengths corresponding to the decoded variable length codewords, in response to an output selectioType: GrantFiled: November 17, 1995Date of Patent: July 15, 1997Assignee: Daewoo Electronics Co., Ltd.Inventor: Gyu-Seok Kim
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Patent number: 5394144Abstract: A variable length code (VLC) decoding apparatus disclosed herein has an interface circuit 10 wherein an input bit stream is fed. The interface circuit 10 includes a plurality of window registers for directly extracting the decoding objective bit stream from the input bit stream. Each of the window registers has 2.sup.n -bit storage locations for storing an bit stream shifted by 1 bit from that of its adjacent window registers. Therefore, the VLC decoding apparatus advantageously achieves a high speed for decoding operation through the use of a plurality of window registers for directly extracting a next undecoded sequence of an input bit stream.Type: GrantFiled: June 8, 1993Date of Patent: February 28, 1995Assignee: Daewoo Electronics Co., Ltd.Inventor: Gyu-Seok Kim