Patents by Inventor GYUMDONG BAE

GYUMDONG BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152188
    Abstract: A display device includes a display module including a first non-folding region, a folding region, and a second non-folding region arranged in a first direction, a first support plate disposed on the display module, a second support plate disposed on the first support plate, a heat dissipation layer disposed between the first and second support plates, and including a bending portion overlapping the folding region, a first adhesive layer disposed between the first support plate and the heat dissipation layer, and a second adhesive layer disposed between the second support plate and the heat dissipation layer. An opening defined in each of the first and second adhesive layers has a width greater than a width of the bending portion of the heat dissipation layer in a portion overlapping the folding region.
    Type: Application
    Filed: January 21, 2024
    Publication date: May 9, 2024
    Inventors: HUN-TAE KIM, JINHYOUNG KIM, DONGHO YOON, GYUMDONG BAE
  • Patent number: 11907031
    Abstract: A display device includes a display module including a first non-folding region, a folding region, and a second non-folding region arranged in a first direction, a first support plate disposed on the display module, a second support plate disposed on the first support plate, a heat dissipation layer disposed between the first and second support plates, and including a bending portion overlapping the folding region, a first adhesive layer disposed between the first support plate and the heat dissipation layer, and a second adhesive layer disposed between the second support plate and the heat dissipation layer. An opening defined in each of the first and second adhesive layers has a width greater than a width of the bending portion of the heat dissipation layer in a portion overlapping the folding region.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hun-Tae Kim, Jinhyoung Kim, Dongho Yoon, Gyumdong Bae
  • Publication number: 20230226804
    Abstract: A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.
    Type: Application
    Filed: January 13, 2023
    Publication date: July 20, 2023
    Inventors: HUN-TAE KIM, Kyunghoon Kim, Gyumdong Bae
  • Publication number: 20220374058
    Abstract: A display device includes a display module including a first non-folding region, a folding region, and a second non-folding region arranged in a first direction, a first support plate disposed on the display module, a second support plate disposed on the first support plate, a heat dissipation layer disposed between the first and second support plates, and including a bending portion overlapping the folding region, a first adhesive layer disposed between the first support plate and the heat dissipation layer, and a second adhesive layer disposed between the second support plate and the heat dissipation layer. An opening defined in each of the first and second adhesive layers has a width greater than a width of the bending portion of the heat dissipation layer in a portion overlapping the folding region.
    Type: Application
    Filed: February 11, 2022
    Publication date: November 24, 2022
    Inventors: HUN-TAE KIM, JINHYOUNG KIM, DONGHO YOON, GYUMDONG BAE
  • Publication number: 20220377908
    Abstract: A release film on a printed circuit board and a connector connected to the printed circuit board includes a first release film disposed on a first surface of the printed circuit board and a surface of the connector, a second release film disposed on a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and a first adhesive attached to a portion of a surface of the first release film that does not overlap the second release film, extending towards the second release film and covering a portion of a surface of the second release film that does not face the first release film.
    Type: Application
    Filed: March 4, 2022
    Publication date: November 24, 2022
    Inventors: HUN-TAE KIM, GYUMDONG BAE, DONGHO YOON