Patents by Inventor Gyun Tae KIM

Gyun Tae KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250192179
    Abstract: The present invention relates to: a copolymer composition comprising a first copolymer including a vinyl alcohol monomer unit and a vinyl amine monomer unit and a second copolymer including a vinyl alcohol monomer unit and an acrylate monomer unit; and to an anode slurry, an anode, and a secondary battery, including the copolymer composition.
    Type: Application
    Filed: March 13, 2023
    Publication date: June 12, 2025
    Inventors: So-Hyun PARK, Se-Man KWON, Chang-Beom KIM, Ji-Hye PARK, Chan-Su PARK, Hyeon-Ji GWON, Gyun-Tae KIM
  • Publication number: 20230268616
    Abstract: The present disclosure relates to a binder for coating a secondary battery separator including a (meth)acrylic copolymer containing a first structural unit derived from (meth)acrylonitrile; a second structural unit derived from (meth)acrylic acid or (meth)acrylate; and a third structural unit derived from (acet)amides, and a separator for a secondary battery and a secondary battery including the same.
    Type: Application
    Filed: June 24, 2021
    Publication date: August 24, 2023
    Inventors: Go Eun LEE, Bo Ok JANG, Jin Yeong KIM, Gyun Tae KIM, Sae Wook OH, Chang Beom KIM, Ji Hye PARK, Se Man KWON
  • Publication number: 20160192085
    Abstract: The present disclosure discloses an MEMS microphone package. The MEMS microphone package in accordance with the present disclosure comprises a lead frame; an integrated MEMS chip mounted on the lead frame, having a vibration unit comprising a diaphragm and a backplate spaced each other with an air gap between them and a signal processing unit for amplifying electric signals generated in the vibration unit formed on a single silicon substrate; and an electric connection means for connecting the lead frame to the integrated MEMS chip.
    Type: Application
    Filed: November 16, 2015
    Publication date: June 30, 2016
    Inventors: Jung Kyu LEE, Gyun Tae KIM, Jong Seo KIM