Abstract: Provided is an adhesive tape for a semiconductor package manufacturing process. The adhesive type includes: a first adhesive layer formed on a first base film; a second base film formed on the first adhesive layer, in which the second base film changes its shape to conform to the topology of the semiconductor package bottom surface when the adhesive tape is attached to the semiconductor package bottom surface, and containing a metal element so as to independently maintain the changed shape during the process; and a second adhesive layer formed on the second base film, the second adhesive layer having a smaller thickness than the first adhesive layer and having a lower adhesive strength than the first adhesive layer, wherein each of the first adhesive layer and the second adhesive layer has a spiral network molecular structure and includes a first adhesive composition containing silicone.

Abstract: The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adhesive tape is configured to include a first base film, a first adhesive layer containing an acrylic-based copolymer, the first adhesive layer being stacked on top of the first base film, a second base film containing a metal material in such a manner as to be deformed and then kept deformed during each process in a manner that corresponds to a topology of the lower surface of the semiconductor package, the second base film being stacked on top of the first adhesive layer, and a second adhesive layer containing silicon having a spiral network structure, the second adhesive layer being on top of the second base film.

Abstract: The present technology is intended to provide an adhesive tape for a semiconductor package manufacturing process, which, in the process of manufacturing a semiconductor package having a plurality of protruding electrodes, may protect the bottom surface of the semiconductor package and the plurality of protruding electrodes formed on the bottom surface of the semiconductor package and may be easily removed from the semiconductor package without leaving residue behind after a given manufacturing process is completed.