Abstract: Provided is a method of controlling a conveyor for item transportation and an electronic apparatus therefor, the method including acquiring information associated with a plurality of destinations, identifying a weight for each of the plurality of destinations based on the acquired information, determining, in response to an item being identified, a destination among the plurality of destinations based on the identified weight, wherein the item is placed in the determined destination, and controlling the conveyor to transport the item to the determined destination.

Abstract: Provided is a method of controlling a conveyor for item transportation and an electronic apparatus therefor, the method including acquiring information associated with a plurality of destinations, identifying a weight for each of the plurality of destinations based on the acquired information, determining, in response to an item being identified, a destination among the plurality of destinations based on the identified weight, wherein the item is placed in the determined destination, and controlling the conveyor to transport the item to the determined destination.

Abstract: Provided is a method of controlling a conveyor for item transportation and an electronic apparatus therefor, the method including acquiring information associated with a plurality of destinations, identifying a weight for each of the plurality of destinations based on the acquired information, determining, in response to an item being identified, a destination among the plurality of destinations based on the identified weight, wherein the item is placed in the determined destination, and controlling the conveyor to transport the item to the determined destination.

Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.

Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.