Patents by Inventor Gyung Sik Yun

Gyung Sik Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with interconnects and method of manufacture thereof
    Patent number: 8609525
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: December 17, 2013
    Assignee: STATS ChipPAC Ltd.
    Inventors: BongHwan Han, Tae Kyu Choi, SeungJoo Kwak, DongWon Son, Gyung Sik Yun
  • Integrated circuit package system with overhang film
    Patent number: 8304898
    Abstract: An integrated circuit package system includes: connecting a first interconnect between a carrier and a bottom integrated circuit thereover; forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interconnect; mounting a top integrated circuit over the film; connecting a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect; and forming an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, and the second interconnect.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: November 6, 2012
    Assignee: STATS ChipPAC Ltd.
    Inventors: Hye Ran Lee, Sang Ha Hwang, Gyung Sik Yun
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20120241964
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 27, 2012
    Inventors: BongHwan Han, Tae Kyu Choi, SeungJoo Kwak, DongWon Son, Gyung Sik Yun
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG FILM
    Publication number: 20090212419
    Abstract: An integrated circuit package system includes: connecting a first interconnect between a carrier and a bottom integrated circuit thereover; forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interconnect; mounting a top integrated circuit over the film; connecting a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect; and forming an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, and the second interconnect.
    Type: Application
    Filed: February 26, 2008
    Publication date: August 27, 2009
    Inventors: Hye Ran Lee, Sang Ha Hwang, Gyung Sik Yun
  • SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS
    Publication number: 20080272487
    Abstract: A wire bond system including providing an integrated circuit die with a bond pad thereon, forming a soft bump on the bond pad, and wire bonding a hard-metal wire on the soft bump.
    Type: Application
    Filed: May 5, 2008
    Publication date: November 6, 2008
    Inventors: Il Kwon Shim, Hun Teak Lee, Sheila Marie L. Alvarez, Gyung Sik Yun, Heap Hoe Kuan