Abstract: A field effect transistor includes a substrate of gallium arsenide having a resistivity of at least about 10.sup.7 ohm/cm and a first buffer layer of gallium arsenide disposed over the substrate having a deep level acceptor dopant incorporated into the buffer layer to compensate for donor dopants incorporated into the buffer layer. The concentration of the donor dopants and the acceptor dopant are controlled to provide the buffer layer with a predetermined resistivity characteristic of about 10.sup.7 -10.sup.8 ohm/cm. The concentration of the deep acceptor dopant is substantially constant at about 10.sup.16 acceptors/cc throughout the first buffer layer. The buffer layer preferably has a thickness of at least 2 microns and preferably between 5 and 30 microns. A second buffer layer is disposed over the first buffer layer having a monotonically declining concentration of chromium dopant from about 10.sup.16 to less than about 10.sup.14 acceptors/cc.

Abstract: A method of growing an epitaxial doped chromium buffer layer is described. A first flow of arsenic trichloride and hydrogen is directed through a retort having disposed therein at an elevated temperature chromium and gallium arsenide crystals. The arsenic trichloride reacts with the chromium and the gallium arsenic crystals to produce chromium chloride, gallium chloride and arsenic. This vapor stream is then directed into a reactor tube where a second flow of gallium chloride and arsenic is provided. Deposited from these flows is gallium arsenide doped with chromium.

Abstract: An epitaxially grown high resistivity crystalline layer of gallium arsenide is produced in a reactor vessel with a predetermined amount of carbon dioxide introduced during growth of the high resistivity gallium arsenide (GaAs) crystalline layer to provide carbon as a dopant. Thus, a plurality of carbon atoms is provided in the crystal, such carbon atoms having electrons at energy levels between a valance energy band and a conduction energy band of the GaAs crystal. With these energy levels, the carbon atoms are substantially ionized at room temperature by accepting a plurality of electrons from the valance band of the GaAs. The presence of these carbon ions in the crystal compensates for a stoichiometric defect which occurs during epitaxial growth of the GaAs crystalline layer. This results in a high resistivity layer which provides a buffer layer between a GaAs substrate and an active GaAs layer.