Patents by Inventor H. Erwin Grellmann

H. Erwin Grellmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5975690
    Abstract: A solid ink stick supply system and related method for delivering solid ink sticks to an ink jet print head reservoir is disclosed. The supply system includes a housing with a keyed plate that guides the ink sticks into the proper loading position in a supply channel. A pusher rod in the supply channel transfers an ink stick onto an endless belt for delivery to the print head reservoir. A push device on the endless belt engages and delivers the ink stick to the print head reservoir. A second ink stick is transferred from the supply channel to the endless belt and is retained on the belt by a stop device. A method for efficiently loading ink sticks into the supply system is also provided.
    Type: Grant
    Filed: January 31, 1997
    Date of Patent: November 2, 1999
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, John B. Gilbert, Robert C. Tidrick, Perry E. Wingfield
  • Patent number: 5917528
    Abstract: A solid ink stick supply system and related method for delivering solid ink sticks to an ink jet print head reservoir is disclosed. The supply system includes a housing with a keyed plate that guides the ink sticks into the proper loading position in a supply channel. A pusher rod in the supply channel transfers an ink stick onto an endless belt for delivery to the print head reservoir. A push device on the endless belt engages and delivers the ink stick to the print head reservoir. A second ink stick is transferred from the supply channel to the endless belt and is retained on the belt by a stop device. A method for efficiently loading ink sticks into the supply system is also provided.
    Type: Grant
    Filed: September 5, 1996
    Date of Patent: June 29, 1999
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, John B. Gilbert, Robert C. Tidrick, Randy C. Karambelas, William B. Weaver, James B. Jensen, Dale R. Peterson
  • Patent number: 5821952
    Abstract: A method for setting a predetermined head-to-print medium distance without utilizing a media clamp is provided. A print medium support surface has a contact length that is less than the length of the print medium. The distance between the print head and the support surface is set to a minimum. Stationary rollers and arcuate guides direct the print medium between a spacing device and the support surface without utilizing a clamp. A shim is interposed between the spacing device and the print medium to move the print head away from the print medium. The shim is retracted leaving the print head spaced from the print medium by the predetermined head-to-print medium distance.
    Type: Grant
    Filed: September 6, 1996
    Date of Patent: October 13, 1998
    Assignee: Tektronix, Inc.
    Inventors: David D. Martenson, Robert C. Tidrick, H. Erwin Grellmann
  • Patent number: 5761597
    Abstract: An improved fusing apparatus for fixing or fusing images on print media is disclosed wherein a relatively small pressure applying surface, such as the surface of a rotatable pressure wheel, is lubricated with a lubricating medium such as silicone oil, and engages the printed image to apply pressure and fuse the image to the image receiving substrate. The fusing apparatus is mounted for reciprocal back and forth movement across the printed image on the image receiving substrate or medium to fuse the image into the substrate and flatten or smooth the upper exposed surface of the ink image. The pressure wheel is passed in multiple overlapping passes over the printed image to uniformly fuse the image into the media.
    Type: Grant
    Filed: September 12, 1996
    Date of Patent: June 2, 1998
    Assignee: Tektronix, Inc.
    Inventors: Craig Smith, H. Erwin Grellmann, Leonard Guan, David D. Martenson
  • Patent number: 5109177
    Abstract: A damped cradle for a pressure sensitive device is constructed in a unitary form. The cradle has a base that is attached to a substrate. Extending upward from the base are side arms with pairs of spring, or compliant, tips that contact the sides of the pressure sensitive device. Also extending upward from the base over the top of the pressure sensitive device are spring arms with compliant tips that contact the top surface of the pressure sensitive device in non-active areas. Vibrational forces in lateral (X-Y plane) directions are damped by friction between the bottom of the pressure sensitive device and the surface of the substrate, and vibration motion in the vertical, or Z, direction is stopped by enough spring force to overcome the maximum acceleration force the crystal mass encompasses for a given application. The spring forces of the spring tips and spring arms are balanced to produce a near zero pressure on the pressure sensitive device in both static and dynamic modes.
    Type: Grant
    Filed: November 28, 1989
    Date of Patent: April 28, 1992
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, Emmanuel Sang
  • Patent number: 4789791
    Abstract: A rotary drive mechanism has a yoke mounted on a motor shaft which engages a crank connected to a device to be rotated, such as the rotary portion of a microwave switch. When the gear motor is activated, the yoke causes the crank to move from a first position to a position past top dead center. A spring connected to the crank causes the crank to snap from the position past top dead center to a second position. A microswitch at the second position provides a signal to brake the motor when the crank reaches the second position. The yoke is configured like a V with the attachment point to the motor being the base of the V. A post from the crank is contained within the area defined by the legs of the V at a point where the shaft will not contact the opposite leg when the crank passes top dead center and is snapped to the second position.
    Type: Grant
    Filed: September 26, 1986
    Date of Patent: December 6, 1988
    Assignee: Tektronix, Inc.
    Inventor: H. Erwin Grellmann
  • Patent number: 4721481
    Abstract: A replaceable RF connector with replaceable fuse has a receptacle mounted on a housing, the receptacle having a cavity and a throughole to the interior of the housing. An RF connector has a connector end for connecting cables and/or adaptors, a receptacle end having a fuse cavity in electrical connection with the connector end, and a flange integral between the connector end and the receptacle end. The receptacle end is configured to slide into the receptacle cavity such that a fuse electrically mounted in the fuse cavity has a lead extending through the receptacle throughole for connection to a circuit internal to the housing. A retainer ring slips over the RF connector such that the connector end protrudes, and is attached to the receptacle such that the RF connector is secured in the receptacle by the flange.
    Type: Grant
    Filed: June 9, 1986
    Date of Patent: January 26, 1988
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, Gerald K. Hein, Brian A. Ohlemeier, Randy C. Karambelas
  • Patent number: 4686492
    Abstract: A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.
    Type: Grant
    Filed: March 4, 1985
    Date of Patent: August 11, 1987
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, Leonard A. Roland
  • Patent number: 4670723
    Abstract: A broad band, thin film attenuator for microwave circuits is constructed by placing a ground plane conductor on one side of a ceramic, insulating substrate, and conductive, resistive, and reactive elements on the other side of the substrate. Capacitive stubs are provided to compensate for inductance in grounding conductors between resistance elements and the ground plane conductor. Constrictions are provided in input and output conductors to provide increased series inductance to compensate for distributed capacitance of the resistance elements. One resistance element is constructed so that the interface between the input conductor and that resistance element forms an obtuse interior angle with an adjoining transitional edge extending from the input conductor to the grounding conductor, and the transitional edge forms an obtuse interior angle with the adjoining edge of the grounding conductor, so as to minimize current density concentrations and distributed capacitance.
    Type: Grant
    Filed: March 18, 1985
    Date of Patent: June 2, 1987
    Assignee: Tektronix, Inc.
    Inventors: Leonard A. Roland, Larry R. Lockwood, H. Erwin Grellmann
  • Patent number: 4657322
    Abstract: A microwave interconnect for integrated or hybrid circuits includes a flexible sheet bearing a flexible conductor which is divided into a plurality of insulated conductive lines, at least some of which make contact with the integrated or hybrid circuit, as well as with a second circuit to which the first is thereby connected. The flexible sheet is backed by a body of elastomeric material and a compression bar which assures good electrical contact of the flexible conductor with the circuits when the compression bar is tightened down on the circuits. The construction allows some degree of misregistration of parts while providing circuit coupling operative at high frequencies.
    Type: Grant
    Filed: October 1, 1985
    Date of Patent: April 14, 1987
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, Keith E. Jones, Carl W. Laakso, John A. Wright
  • Patent number: 4598334
    Abstract: A capacitive tuning screw comprises a threaded portion with a longitudinal cavity for slidably receiving a plunger shaft. If the capacitive element on the tip of the plunger shaft contacts the corresponding capacitive element on the surface of an electrical circuit board or substrate, further turning of the screw will cause the shaft to slide into the cavity and prevent crushing the circuit board or substrate. A shoulder on the screw stops rotation and longitudinal movement of the screw before the entire length of the plunger shaft slides into the cavity.
    Type: Grant
    Filed: February 7, 1985
    Date of Patent: July 1, 1986
    Assignee: Tektronix, Inc.
    Inventors: H. Erwin Grellmann, Keith E. Jones, John A. Wright