Patents by Inventor H. Frank Greer

H. Frank Greer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to improve indium bump bonding via indium oxide removal using a multi-step plasma process
    Patent number: 8163094
    Abstract: A process for removing indium oxide from indium bumps in a flip-chip structure to reduce contact resistance, by a multi-step plasma treatment. A first plasma treatment of the indium bumps with an argon, methane and hydrogen plasma reduces indium oxide, and a second plasma treatment with an argon and hydrogen plasma removes residual organics. The multi-step plasma process for removing indium oxide from the indium bumps is more effective in reducing the oxide, and yet does not require the use of halogens, does not change the bump morphology, does not attack the bond pad material or under-bump metallization layers, and creates no new mechanisms for open circuits.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: April 24, 2012
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: H. Frank Greer, Todd J. Jones, Richard P. Vasquez, Michael E. Hoenk, Matthew R. Dickie, Shouleh Nikzad