Patents by Inventor H. Henry Von Tresckow

H. Henry Von Tresckow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130019458
    Abstract: A support system for a semiconductor device during a wire or ribbon bonding operation is provided. The support system includes a body portion defining an upper surface. The upper surface has an upper surface contact region configured to support at least a portion of a lower surface of a semiconductor device at a lower surface contact region during a wire or ribbon bonding operation. The support system also includes a plurality of protrusions on the upper surface contact region.
    Type: Application
    Filed: April 12, 2011
    Publication date: January 24, 2013
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Jonathan M. Byars, Theodore J. Copperthite, H. Henry Von Tresckow