Patents by Inventor H. Jin SIM

H. Jin SIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dry type electrical insulation
    Patent number: 9281098
    Abstract: A dry type electrical insulation is provided. The insulation includes a base fiber having an outer surface and a first melting point and a binder material, coated onto the outer surface of the base fiber, having a second melting point. In this insulation, the second melting point is lower than the first melting point. A dry type insulation matrix is also provided. The insulation matrix includes a plurality of composite fibers having a base fiber having a first melting point and a binder material co-extruded therewith, having a second melting point. In this insulation matrix, the second melting point is lower than the first.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: March 8, 2016
    Assignee: Waukesha Electric Systems, Inc.
    Inventors: Thomas M. Golner, Shirish P. Mehta, H. Jin Sim
  • DRY TYPE ELECTRICAL INSULATION
    Publication number: 20120202059
    Abstract: A dry type electrical insulation is provided. The insulation includes a base fiber having an outer surface and a first melting point and a binder material, coated onto the outer surface of the base fiber, having a second melting point. In this insulation, the second melting point is lower than the first melting point. A dry type insulation matrix is also provided. The insulation matrix includes a plurality of composite fibers having a base fiber having a first melting point and a binder material co-extruded therewith, having a second melting point. In this insulation matrix, the second melting point is lower than the first.
    Type: Application
    Filed: June 9, 2011
    Publication date: August 9, 2012
    Applicant: WAUKESHA ELECTRIC SYSTEMS, INC.
    Inventors: Thomas M. GOLNER, Shirish P. MEHTA, H. Jin SIM